A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.

Disclosed are an implantable flexible neural microelectrode comb, and a preparation method and implantation method therefor. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer (1), a flexible insulation layer (2), and a metal connection wire layer (3) arranged between the flexible substrate layer (1) and the flexible insulation layer (2); the flexible neural microelectrode comb comprises a filament structure (4), a mesh structure (5), a plane structure (6) and a bonding pad area (7) connected in sequence; electrode sites (8) are arranged on the filament structure (4); bonding pads are arranged on the bonding pad area (7); the metal connection wire layer (3) is composed of metal connection wires connecting the electrode sites (8) and the bonding pads; and the flexible insulation layer (2) is not arranged on the surfaces of the electrode sites (8) and the bonding pads. The prepared flexible neural microelectrode comb has a structure gradually changing from a filament to a mesh to a plane structure, thus improving mechanical stability during a deformation process. The mechanical properties of the implantable flexible neural microelectrode comb match brain tissue, the implantation footprint is small, an inflammatory response of the brain is avoided, and electrophysiological signals in the brain can be stably tracked and measured in a multi-site manner for a long time.

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.

A method for manufacturing a micromechanical structure and a micromechanical structure. The method includes: forming a first micromechanical functional layer; forming a plurality of trenches in the first micromechanical functional layer, which include an upper widened area at the upper side of the first micromechanical functional layer and a lower area of essentially constant width; depositing a sealing layer on the upper side of the first micromechanical functional layer to seal the plurality of trenches, a sealing point of the plurality of trenches being formed below the upper side of the first micromechanical functional layer and the first trenches being at least partially filled; thinning back the sealing layer by a predefined thickness; and forming a second micromechanical functional layer above the thinned-back sealing layer.

A method for manufacturing a micromechanical structure and a micromechanical structure. The method includes: forming a first micromechanical functional layer; forming a plurality of trenches in the first micromechanical functional layer, which include an upper widened area at the upper side of the first micromechanical functional layer and a lower area of essentially constant width; depositing a sealing layer on the upper side of the first micromechanical functional layer to seal the plurality of trenches, a sealing point of the plurality of trenches being formed below the upper side of the first micromechanical functional layer and the first trenches being at least partially filled; thinning back the sealing layer by a predefined thickness; and forming a second micromechanical functional layer above the thinned-back sealing layer.

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.

A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.

A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.

A method for producing a microstructure is disclosed. A master is provided having a pattern formed of conductive material embedded in a non-conducting substrate. The master has a master surface having a conducting portion defined by the pattern and a non-conducting portion defined by the non-conducting substrate. A surface treatment is applied to the master surface to alter the adhesion properties of at least one of the conducting portion or the non-conducting portion. The microstructure is formed by deposition or plating of a functionalising material onto the master surface, and the microstructure is then separated from the master. The master can be reused.