The present disclosure is directed to a trap filter system having a plurality of filters, the plurality of filters having filtering materials to remove contaminants from a flow of gas effluents generated by a semiconductor processing tool and a bypass mechanism configured to selectively direct or shut off the flow of gas effluents to one or more of the plurality of filters while the semiconductor processing tool remains in operation. Each of the plurality of filters is removable and replaceable when the filtering material is unable to effectuate the removal of contaminants.

An ozone generating system, a controller and a method for generating ozone in an enclosed space is provided. The system can include a housing, an intake vent, an exhaust vent, a blower provided in the housing, an ozone generator to route generated ozone into the enclosed space and an ozone sensor. The controller and method can include adding ozone to air in an enclosed space to form ozone enriched air, until a set ozone target level is reached and maintaining the ozone level in the enclosed space in a desired ozone range for a treatment time period.

Disclosed is a system for treating exhaust fluid from semiconductor manufacturing equipment in which cleaning gases decomposed by a plastic apparatus alternately flow towards a front rotor region (a main rotor unit) and a rear rotor region (a subsidiary rotor unit) of a booster pump and then flow towards a dry pump, and thus uniformly react with process byproducts present throughout the whole area in a vacuum pump including the booster pump and the dry pump so as to improve removal efficiency of the process byproducts. Further, the retention time of the cleaning gases decomposed by the plasma apparatus in the vacuum pump is increased by adjusting the pressure in the pump with the rotational speed of a motor, and thus the reaction time of the cleaning gases with the process byproducts is increased, so as to further improve removal efficiency of the process byproducts, such as SiO.sub.2 powder.

Disclosed is a system for treating exhaust fluid from semiconductor manufacturing equipment in which cleaning gases decomposed by a plastic apparatus alternately flow towards a front rotor region (a main rotor unit) and a rear rotor region (a subsidiary rotor unit) of a booster pump and then flow towards a dry pump, and thus uniformly react with process byproducts present throughout the whole area in a vacuum pump including the booster pump and the dry pump so as to improve removal efficiency of the process byproducts. Further, the retention time of the cleaning gases decomposed by the plasma apparatus in the vacuum pump is increased by adjusting the pressure in the pump with the rotational speed of a motor, and thus the reaction time of the cleaning gases with the process byproducts is increased, so as to further improve removal efficiency of the process byproducts, such as SiO.sub.2 powder.

Provided is a device that uses ozone, hydrogen peroxide, and hydroxyl radicals to sterilize, detoxify and purify indoor air, while simultaneously removing radon gas. The device is provided with a condensing unit (10) having a Peltier structure, and further provided with a device (2) that discharges electricity and generates ozone. The device further has an ultraviolet lamp (9) and a titanium dioxide coating for creating a titanium dioxide physical environment. The device is also provided with generation boxes (3, 5). Ultrasonic waves are used to electrolyze a liquid, such as water, hydrogen peroxide or oxygen, in the generation boxes (3, 5), so as to further generate hydroxyl radicals.

A detoxification device has an inlet nozzle capable of reducing an amount of a deposit of an adhering metallic product and elongating a maintenance cycle and a detoxification device including the inlet nozzle. The inlet nozzle includes a portion adjacent to a combustor, that is cut (removed) in advance. Consequently, in the portion, an insulator made of a ceramic material is exposed. Since the ceramic material supplies a small number of electrons, even when the insulator is exposed to heat from the combustor to reach a high temperature, a reductive reaction is less likely to occur. Accordingly, even when a metallic exhaust gas is allowed to flow, the metallic exhaust gas is prevented from being precipitated as the metallic product and gradually deposited with time.

A detoxification device has an inlet nozzle capable of reducing an amount of a deposit of an adhering metallic product and elongating a maintenance cycle and a detoxification device including the inlet nozzle. The inlet nozzle includes a portion adjacent to a combustor, that is cut (removed) in advance. Consequently, in the portion, an insulator made of a ceramic material is exposed. Since the ceramic material supplies a small number of electrons, even when the insulator is exposed to heat from the combustor to reach a high temperature, a reductive reaction is less likely to occur. Accordingly, even when a metallic exhaust gas is allowed to flow, the metallic exhaust gas is prevented from being precipitated as the metallic product and gradually deposited with time.

A plant air purifier with filter material within a filter bed container, wherein the filter material can both allow air to pass through it during the unit's air purification phase and for water to submerge the filter material during its remoisturization phase The unit itself passes through various phases and sub phases: an air purification phase; followed by a remoisturization phase, which includes an immersion of the filter material sub phase, and a draining away of the water during its drainage sub phase. And in some cases, a soaking sub phase of the filter material for some time. Three different embodiments of the unit are provided: a unit with a separate soaking; chamber outside the unit; one with an outer pot surrounding the filter container; and one with a flapper below the filter bed container.

Embodiments of point-of-use (POU) abatement device and methods of abating a plurality of gas streams from a corresponding plurality of processing chambers are provided herein. In some embodiments, a compact POU abatement device includes a plurality of inlets respectively coupled to a plurality of process chambers in which each of the process chambers gas streams is isolated from the other gas streams. In some embodiments, the compact POU abatement device can include a plurality of oxidation devices and a corresponding plurality of wet scrubber columns each directly coupled to ones of the plurality of inlets to receive a gas stream from a corresponding process chamber.

Embodiments of point-of-use (POU) abatement device and methods of abating a plurality of gas streams from a corresponding plurality of processing chambers are provided herein. In some embodiments, a compact POU abatement device includes a plurality of inlets respectively coupled to a plurality of process chambers in which each of the process chambers gas streams is isolated from the other gas streams. In some embodiments, the compact POU abatement device can include a plurality of oxidation devices and a corresponding plurality of wet scrubber columns each directly coupled to ones of the plurality of inlets to receive a gas stream from a corresponding process chamber.