According to one embodiment, a silicon-containing product forming apparatus includes a reaction chamber, an emission path, a process liquid tank, a supplier, and a flow path switcher. The emission path emits an emission material from the reaction chamber. The supplier includes a supply line configured to supply a process liquid to the emission path from the process liquid tank, and a byproduct generated by reaction is treated in the emission path by the supplied process liquid. The flow path switcher switches the communication state of the emission path with each of the reaction chamber and the supply line of the supplier.

A process is described for removing halogen compounds, particularly chlorine compounds, from a process fluid, comprising the steps of (i) passing a process fluid containing hydrogen halide over a first sorbent to remove hydrogen halide and generate a hydrogen halide depleted process fluid and then, (ii) passing the hydrogen halide depleted process fluid over a second different sorbent to remove organic halide compounds therefrom. A purification system suitable for removing hydrogen halide and organic halide compounds from process fluids is also described.

Venturi Scrubbers are used to separate particulate from a large range of fluids. Many provide additional liquid and/or gas to drive the fluid and aid in the removal of particulate. The present invention provides a liquid ring pump through which the fluid to be treated is first passed and then exhausted, with additional work fluid to a Venturi scrubber such that the particulate can be separated from the exhaust fluid.

A method for removing contaminants from a fluid stream. More particularly, described herein is a method for removing ammonia and acid gas from an air flow. A method of making a metal zeolite impregnated fiber filter is also described. Also described herein is a method of monitoring the continued usefulness of a zeolite impregnated fiber filter.

Implementations of the present disclosure relate to systems and techniques for abating F-gases present in the effluent of semiconductor manufacturing processes. In one implementation, a water and oxygen delivery system for a plasma abatement system is provided. The water and oxygen delivery system comprises a housing that includes a floor and a plurality of sidewalls that define an enclosed region. The water and oxygen delivery system further comprises a cylindrical water tank positioned on the floor, wherein a longitudinal axis of the cylindrical water tank is parallel to a plane defined by the floor and a length of the water tank is 1.5 times or greater than the diameter of the cylindrical water tank. The water and oxygen delivery system further comprises a flow control system positioned within the housing above the cylindrical water tank.

A method for the purification of a raw gas stream by selective catalytic oxidation, in which organic and inorganic sulfur compounds, halogenated and non-halogenated volatile organic compounds are selectively oxidized without substantially oxidizing the lower hydrocarbons and the sulfur containing compounds present in the gas to sulfur trioxide and excess of oxygen is removed by oxidation of lower alcohols, ethers or hydrogen added to the raw gas stream upstream the catalytic oxidation.

Disclosed is a system for integrally treating a composite waste gas including nitrogen oxides (NO.sub.x and N.sub.2O), chlorofluorocarbons (CFCs), hydrochlorofluorocarbons (HCFCs), hydrofluorocarbons (HFCs), and perfluorinated compounds (PFCs). The system includes a first wet processor configured to wash and adsorb dust including gases, SO.sub.x, and ash dissolved in water, a decomposing reactor configured to receive waste gas processed in the first wet processor and process nitrogen oxides (NO.sub.x and N.sub.2O), fluorocarbons (CFCs), hydrochlorofluorocarbons (HCFCs), hydrofluorocarbons (HFCs), and perfluorinated compounds (PFCs) in the waste gas, and a second wet processor configured to receive the waste gas processed in the decomposing reactor and wash and adsorb the received waste gas. The system can efficiently treat a large amount of composite waste gas.

A substrate processing apparatus includes a processing container configured to accommodate a substrate and perform a substrate processing that generates a byproduct that becomes a source of a harmful gas; and a liquid holder provided in an area of the processing container where the byproduct generated by the substrate processing adheres and configured to hold a liquid that adsorbs the byproduct.

Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a chamber including a top substrate holder and a bottom substrate holder. In some embodiments, an exhaust port is located at a midpoint between the top substrate holder and the bottom substrate holder. Methods and systems in accordance with these and other embodiments are also disclosed.

In some embodiments, a side storage pod apparatus of an equipment front end module (EFEM) includes a side storage enclosure having a surface configured to couple to a side wall of a body of the equipment front end module, and an opening configured to receive substrates from the equipment front end module. The EFEM further includes a side storage chamber within the side storage enclosure having a plurality of support members configured to support substrates thereon. The EFEM further includes a plenum chamber provided proximate the side storage chamber, the plenum chamber being a separate chamber from the side storage chamber and an exhaust port coupled to the plenum chamber.