An inlet assembly for a an abatement burner includes: an inlet conduit operable to convey an effluent gas stream to be treated from an inlet aperture via a bore to an outlet aperture for treatment; and a lance conduit operable to convey a fuel gas from a gas inlet aperture via a gas bore to a gas outlet aperture positioned within the bore for mixing with the effluent gas stream, a cross-sectional area of the gas bore increasing towards the gas outlet aperture. In this way, the expansion caused by the increasing cross-sectional area of the gas bore enhances the mixing of the fuel gas with the effluent gas stream which provides for improved destruction and removal efficiencies (DRE), which enables the inlet assembly to be operated with reduced quantities of fuel gas, while still maintaining required levels of DRE.

Embodiments of the present disclosure relate to gas abatement apparatus and effluent management. The apparatus described herein include a high pressure process chamber and a containment chamber surrounding the process chamber. A high pressure fluid delivery module is in fluid communication with the high pressure process chamber and is configured to deliver a high pressure fluid to the process chamber. An effluent management module includes a muffler assembly to effluent pressure reduction and a plurality of scrubbers provide for treatment of effluent.

The present invention provides an energy-efficient method and apparatus that can achieve exhaust gas abatement with a minimum use of diluent nitrogen gas. More specifically, the present invention is directed to a method and apparatus for exhaust gas abatement under reduced pressure, in which an exhaust gas supplied from an exhaust gas source via a vacuum pump is decomposed by heat of a high-temperature plasma under a reduced pressure.

The present invention provides an energy-efficient method and apparatus that can achieve exhaust gas abatement with a minimum use of diluent nitrogen gas. More specifically, the present invention is directed to a method and apparatus for exhaust gas abatement under reduced pressure, in which an exhaust gas supplied from an exhaust gas source through a vacuum pump is decomposed by combustion heat of a flame under a reduced pressure.

An agent for removing a halogen gas, such as chlorine, in a waste gas by means of reduction; a method for producing this agent; a method for removing a halogen gas by use of this agent; and a system for removing a halogen gas. The agent for removing the halogen gas contains at least pseudo-boehmite, that serves as a host material, and a sulfur-containing reducing agent, that serves as a guest material. 1-8% by weight of the reducing agent, in terms of elemental sulfur, based on the total amount of the pseudo-boehmite and sulfur-containing reducing agent is present in the agent. At least one inorganic compound selected from among oxides, carbonates salts and hydrocarbon salts of alkaline earth metal elements, transition metal elements and zinc group elements is additionally contained in the agent as a third component.

A piping system is provided, connecting a plurality of scrubbers which are disposed on a supporting structure, including a collecting pipe and a drain pipe. The collecting pipe has a main body and a plurality of protrusions, wherein the main body has an outer surface and a first central axis. The protrusions are protruding from the outer surface, and the first central axis is perpendicular to the supporting structure. The collecting pipe communicates with the scrubbers via the protrusions. The drain pipe is disposed under the supporting structure and has a second central axis, wherein the collecting pipe is extended through the supporting structure and connects to the drain pipe, and the first central axis is perpendicular to the second central axis.

Provided are a waste gas processing device, a vacuum coating system, and an operation method of the waste gas processing device. The waste gas processing device is configured to remove and recover arsenic in the waste gas, and includes a condensation portion and a scraping portion. The condensation portion is provided with a condensation cavity, and an air inlet, an air outlet and a discharge port communicated with the condensation cavity. A partial surface of the scraping portion abutting against an inner wall surface of the condensation cavity. The present disclosure solves a problem in a conventional art that an economic cost of a waste gas processing device is too high during the removal and recovery of arsenic in waste gas.

Provided are a waste gas processing device, a vacuum coating system, and an operation method of a waste gas processing device. The waste gas processing device is configured to remove and recover arsenic in waste gas, and includes a condensation portion and a scraping portion. The condensation portion is provided with a condensation cavity, and an air inlet, an air outlet and a discharge port communicated with the condensation cavity. The condensation portion is configured to cool waste gas charged into the condensation cavity from the air inlet, so that gaseous arsenic in the waste gas is condensed on an inner wall surface of the condensation cavity by cooling to form solid arsenic. The scraping portion is rotatably provided in the condensation cavity, and a partial surface of the scraping portion abuts against the inner wall surface of the condensation cavity.

A semiconductor waste abatement system for a semiconductor processing system includes a vacuum pump, an abatement apparatus having an abatement chamber in fluid communication with a source of semiconductor waste gas from the semiconductor processing chamber, and with the abatement chamber configured to ionize the waste gas and to exhaust ionized gas. The abatement system further includes a filter apparatus with a filter chamber, which forms a liquid reservoir. The inlet of the filter apparatus is in fluid communication with the outlet of the abatement chamber and the liquid reservoir, and the outlet of the filter apparatus is in communication with the inlet of the vacuum pump, wherein the filter chamber is under a vacuum, and wherein semiconductor waste gas is ionized in the abatement chamber and then filtered by the filter apparatus prior to input to the vacuum pump.

A system to abate an emission stream from a semiconductor manufacturing process is disclosed. The system includes an abatement apparatus, such as a gas scrubber, to remove hazardous and toxic gas species from the emission stream and to yield an emission having carbon dioxide. The system condenses the emission having carbon dioxide to an effluent, and transmits the effluent through a reduction tower. The reduction tower catalyzes a chemical reaction which absorbs carbon dioxide from the effluent using a solution and yields an exhaust substantially free of carbon dioxide. The reduction tower is coupled to an exchanger which catalyzes a thermogenic reaction to release absorbed carbon dioxide from the solution. The system may include a closed-loop system that transmits solution substantially free of carbon dioxide from the exchanger and through the reduction tower to absorb carbon dioxide from additional effluent.