B01D2258/0216

Apparatus and method for solvent recovery from drying process

Method and apparatus for condensing a majority of the solvent in a process gas stream at low temperatures, e.g., below the freezing point of water, ca. −5° C. The gas stream exiting the condenser step may be further processed in one or more emission control devices, such as a single or multi-step series of concentrator devices, such as zeolite concentrator devices. One or more emission control operations can be carried out downstream of the single or multi-step concentrators. The aforementioned condensing process enables the one or more concentrators to operate in a favorable temperature range for removal of 99% or more of VOC, thereby meeting or exceeding strict environmental regulations.

METHODS OF MONITORING GAS BYPRODUCTS OF A BONDING SYSTEM, AND RELATED MONITORING SYSTEMS AND BONDING SYSTEMS
20230260953 · 2023-08-17 ·

A method of monitoring gas byproducts of a bonding system is provided. The method includes: providing a plurality of bonding systems, each of the bonding systems including a reducing gas delivery system for use in connection with a bonding operation, each of the bonding systems being configured for exhausting gas byproducts; connecting each of the bonding systems to a monitoring device using a respective gas delivery path; and monitoring a composition of at least a portion of the gas byproducts with the monitoring device.

APPARATUS FOR TREATMENT GASEOUS POLLUTANTS
20220134281 · 2022-05-05 ·

An apparatus for treatment of gaseous pollutants, the apparatus comprising a reaction portion and a passage. The reaction portion comprises a gas inlet unit, a reaction unit, a combustion unit and a cooling unit. The passage comprises a transverse section, a connection section and a straight section, the transverse section is provided with a top gas inlet in communication with the reaction portion and a lateral gas inlet, the connection section is connected between the transverse section and the straight section, the top gas inlet receives an effluent passing through the reaction portion and then flowing downwards, the lateral gas inlet receives a transverse air flow, and the effluent is driven by the transverse gas flow to form a cyclone and is discharged from an outlet of the straight section by means of the connection section.

AIR PROCESSING SYSTEM FOR SEMICONDUCTOR CONTAINER

A container includes a container body and an air processing system. The container body includes a plurality of walls defining an interior space for receiving wafers. The air processing system is attached to the container body. The air processing system includes an exchange module, an air extraction module, a first contaminant removal module, a processing module, a second contaminant removal module, a controller module and a power module. The exchange module is coupled to one of the walls of the container body. The air extraction module extracts air from the container body. The first contaminant removal module is coupled to the air extraction module and the exchange module. The processing module is coupled to the air extraction module. The second contaminant removal module is coupled to the processing module and the exchange module. The controller module is configured to turn the air extraction module on and off.

Ultramicro to mesopore frameworks for selective separation and storage of noble gases

Methods and materials for the selective capture and storage of preselected materials from gas streams using metal organic framework (MOF) materials are described. In various embodiments preselected target material gases could include noble gasses such as Kr, Xe, Rn, Arultramicro to mesopore frameworks for selective separation and storage of noble gases, other gasses such as I.sub.2 or other particular isotopes either naturally occurring or man-made, or another preselected gas capture material such as a target material for legal, regulatory or treaty compliance, or a preselected material from a particular process such as a cleaning or etching agent from semiconducting or microelectronic manufacture, or a portion of an anesthetic gas such as nitrous oxide, isoflurane, sevoflurane or a fluorinated ethers.

GAS TREATMENT DEVICE AND VACUUM LINE
20230249118 · 2023-08-10 · ·

A gas treatment device treats, at atmospheric pressure, the gases pumped by at least one rough pumping device. The gas treatment device includes a treatment chamber and at least one discharge pipe to connect a discharge of the at least one rough pumping device to an inlet of the treatment chamber. The gas treatment device further includes at least one auxiliary pumping device to lower the pressure in the at least one discharge pipe, situated less than 1 meter from the inlet of the treatment chamber, such as less than 50 cm.

FLAMELESS CATALYTIC THERMAL OXIDATION DEVICE
20230249129 · 2023-08-10 · ·

An object of the present invention is to provide a new frameless catalytic thermal oxidation device capable of treating concentrations of harmful materials including NOx at a low temperature. Further, another object of the present invention is to provide a frameless catalytic thermal oxidation device capable of minimizing the occurrence of THC and minimizing a risk of accidents and environmental pollution which may occur in maintenance operations. According to the objects, the present invention provides a cartridge-type thermal oxidation device capable of being separated for maintenance, wherein a cartridge internal structure is configured so that the time while the material to be treated stays in a zone with the catalyst is increased, and a member capable of dropping and collecting powder generated by thermal oxidation reaction is configured.

A Green Resource-Generating Method Based on Thermal Mass Synergy of Waste Integrated Circuit Board
20220119714 · 2022-04-21 ·

A green resource-based method of thermal mass synergy in waste Integrated circuit board mainly includes carbonization cracking system, crushing and separation system, gasification cracking system and heat value utilization and comprehensive recovery system. Compared with existing techniques, carbonization cracking system can realize the dry distillation cracking of organic matter in waste integrated circuit board which converts carbon, hydrogen and other elements into fuel carbonized cracking gas and cracking oil, the heat from the combustion of the carbonization cracking gas of the invention provides the energy needed for the carbonization cracking to realize self-heating carbonization cracking. Carbonization cracking products are cracked and separated to solve the problems such as hard to break and organic coating metal caused by direct crushing and separation of traditional circuit boards which Improves crushing and separation effect; gasification cracking system achieves the comprehensive utilization of carbon, the gasified cracking gas can be used as a heat source for subsequent valuable metal recovery to further improve the utilization rate of calorific value. The invention has the characteristics of: high heat value utilization rate, low energy consumption, high metal recovery rate, short process recovery of valuable metal and no pollution of flue gas.

Gas recovering apparatus, semiconductor manufacturing system, and gas recovering method
11766635 · 2023-09-26 · ·

According to one embodiment, a gas recovering apparatus includes a casing and a tube. The casing is provided with an inlet through which a gas flows in, a first outlet for discharging a first gas containing a gas to be recovered of the gas, and a second outlet for discharging a second gas other than the first gas of the gas. The casing is evacuated via the first outlet. The tube is provided in the casing from the inlet to the second outlet, and has a high permeability to the first gas and a low permeability to the second gas.

Plasma abatement of compounds containing heavy atoms

A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH.sub.4, H.sub.2O, H.sub.2, NF.sub.3, SF.sub.6, F.sub.2, HCl, HF, Cl.sub.2, and HBr. Representative condensing abating reagents include, for example, H.sub.2, H.sub.2O, O.sub.2, N.sub.2, O.sub.3, CO, CO.sub.2, NH.sub.3, N.sub.2O, CH.sub.4, and combinations thereof.