The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting unit configured to adjust a pressure of the inner space, and wherein the pressure adjusting unit comprises: a first pressure adjusting unit; and a second pressure adjusting unit in which a size for changing a pressure of the inner space per unit time is greater than the first pressure adjusting unit.

Aspects herein are directed to an article of apparel having a vent opening formed by overlapping the edges of a first panel and a second panel. A plurality of discrete overlay film structures are applied to the second panel adjacent to the vent opening. When the article of apparel is exposed to an external stimulus, the film structures undergo a reversible increase in dimension in at least the z-direction which cause the second panel of material to undergo a reversible decrease in dimension in the direction of a longitudinal axis of the vent opening thereby causing the vent opening to dynamically transition from a closed state to an open state.

A glue dispenser dispensing switch includes a switching device main body, a needle holding base, a wear-resistant plate, and a rotating device. The switching device main body is equipped with a double liquid inlet, the needle holding base is equipped with a mixed glue outlet, the wear-resistant plate is installed between the switching device main body and the needle holding base, and the wear-resistant plate is equipped with a wear-resistant plate opening. The rotating device is utilized to rotate the needle holding base or the wear-resistant plate. A mixed double-liquid glue passes through the double liquid inlet, the wear-resistant plate opening and the glue outlet to dispense a mixed glue while the double liquid inlet, the wear-resistant plate opening and the glue outlet are overlapped. In addition, a double liquid dispensing equipment is also disclosed herein.

A nozzle for dispensing adhesive between a first part and a second part comprises a nozzle body. The nozzle body comprises a first-part engagement surface. The nozzle body also comprises a second-part engagement surface, contiguous with the first-part engagement surface and defining an engagement-surface angle, greater than 0° and less than 180°, with a virtual plane, coincident with the first-part engagement surface. The nozzle body further comprises a nozzle-body outlet port, formed in the second-part engagement surface. The nozzle body additionally comprises a nozzle-body inlet port, formed in the first-part engagement surface. The nozzle also comprises a separator plate, coupled with and extending from the nozzle body.

Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.

An automatic wood flooring boards reparation device for applying and spreading filler over boards is provided, the device comprising an infeed unit, an outfeed unit and a filler applicator. The filler applicator applies filler over a top surface of the boards with a head comprising a main body, a spreading device and a bottom portion, each part comprising an opening for distributing filler over the board and an opening for securing a scrapper for spreading the applied filler. A tight seal is created between a filler applicator opening of the bottom portion and the top surface of the boards to avoid overspill of filler. A method for applying filler is also provided.

Provided is an apparatus for processing a substrate. The substrate processing apparatus includes: a processing unit processing a substrate; and a gas supply unit supplying gas to the processing unit, in which the gas supply unit includes a first housing having a first internal space which is in fluid communication with a processing space of the processing unit, a second housing disposed in the first internal space, and having a second internal space which is in fluid communication with the first internal space, and a gas supply duct supplying the gas to the second internal space.

A method and apparatus for applying a viscous fluid onto a surface. An applicator associated with an extension member may be positioned over the surface using a robotic operator. The extension member may be configured to maintain a selected distance between the applicator and a fluid source for the viscous fluid. The viscous fluid may be dispensed from the fluid source to the applicator. The viscous fluid may be applied onto the surface using the applicator.

A rotary tank assembly is provided for a liner. The liner is structured to apply a compound to a plurality of container closures. The rotary tank assembly includes a compound tank, a fill tube structured to fill the tank with a volume of the compound to a desired level, a sensor assembly adapted to measure the level of the compound within the compound tank, and a rotary union assembly structured to pivotably couple the fill tube and the sensor assembly to the compound tank. The sensor assembly only requires one single probe.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.