A can coating machine control system includes a coating control signal that functions as a go/no-go signal based on a plurality of monitored conditions such as can in position, vacuum pressure, gun in position, guard in position and speed condition. Local pressure regulation of the coating material in the spray gun is provided along with optional control of the material temperature. Local pressure regulation allows for optional spray weight control based on a wrap number derived from speed and gun spray durations. A CAN to CAN network buffer is provided as well for primary network isolation. A gun control circuit may be used to select specific gun drive signals and to adjust gun drive signals based on real-time feedback of the actual spray duration.

In an apparatus for treating a wafer-shaped article, a spin chuck is configured to hold a wafer-shaped article of a predetermined diameter. A non-rotating plate is positioned relative to the spin chuck such that the non-rotating plate is beneath and parallel to a wafer-shaped article when positioned on the spin chuck. A fluid dispensing nozzle passes through the non-rotating plate and terminates in a discharge end positioned above and adjacent to the non-rotating plate. The discharge end comprises a horizontal gas discharge nozzle configured to distribute gas radially outwardly across an upper surface of the non-rotating plate.

A system capable of depositing a matrix film containing a low amount of impurities (e.g. neutral particles) is provided. The system includes: a first plate electrode 120 having an attachment surface on which a sample plate P is to be attached; a second plate electrode 130 arranged so as to face the attachment surface; a nozzle 110 for spraying a liquid containing a matrix substance into the space between the two electrodes 120 and 130 by an electrospray method, the nozzle 110 arranged so that none of the electrodes 120 and 130 lies on the central axis A of a spray flow of the liquid; and an electric field creator 140 for creating, between the two electrodes 120 and 130, an electric field for forcing electrically charged droplets contained in the spray flow of the liquid containing the matrix substance to move toward the attachment surface.

The invention belongs to the field of automatic equipment technology, and discloses a spot gluing, feeding and cutting automata for horn assembly, wherein products are transported and delivered through an automatic feeding and cutting module for horns and horn hoods; horns and horn hoods are grabbed onto a bearing platform module by a grabbing module; circular spot gluing is done by a gluing module and a carrier module; and finally horn disks are automatically assembled by an unloading module with defective products removed. Different workstations perform their duties and work closely together, so as to realize the automatic delivery of products, automatic assembly of horns into horn hoods, automatic gluing, and automatic assembly and recovery of horn disks. The automata features high efficiency, stable quality, high degree of automation, good effect, low production cost, and convenient, simple and fast use.

A method of coating a fastener assembly that extends from a substrate comprises steps of at least partially saturating a permeable body with a volume of a liquid and covering the fastener assembly with the permeable body. The step of covering the fastener assembly with the permeable body comprises at least partially compressing the permeable body against the fastener assembly and transferring a portion of the volume of the liquid from the permeable body to an exposed outer surface of the fastener assembly and to a ring on the substrate, surrounding the fastener assembly.

A substrate treating apparatus includes a plurality of solution treating units for performing solution treatment of substrates, and a plurality of individual gas supply devices provided to correspond individually to the solution treating units, each for supplying gas at a variable rate only to one of the solution treating units. The solution treating units perform the solution treatment by supplying treating solutions to the substrates. The individual gas supply devices supply gas only to the solution treating units corresponding thereto. The individual gas supply devices supply the gas at adjustable rates to the solution treating units. The rate of gas supply to the solution treating units can therefore be varied for each solution treating unit.

A sealant discharging nozzle includes a nozzle body, a flat surface, a nozzle positioning portion, and a locating pin. The flat surface is provided on the nozzle body and is formed on a discharge port side of a through hole that extends along a central axis of the nozzle body. The nozzle positioning portion includes a pair of tapered surfaces disposed on both sides of the flat surface in a width direction of the flat surface. The locating pin is formed between the pair of tapered surfaces.

The invention relates to a gluing device, for gluing brick slips, a system for gluing brick slips and a method for gluing brick slips, for example for providing brickwork veneer. Gluing device comprising:—a support;—a glue container that extends from a first end to a second end, wherein the glue container is operatively connected to the support;—a discharge nozzle that is operatively connected to the first end of the glue container and that is provided with a discharge opening; and—a plunger that, during use of the device, is positioned in the glue container and that is provided with a drive side facing the first end of the glue container and a press side facing the second end of the glue container, and wherein the plunger is operatively connected to the support, wherein the plunger and the container are connected to the support and wherein one of the plunger and the container is moveably connected to the support with respect to the other of the plunger and the container, such that the plunger and the container are moveable relative to each other.

A development device includes a casing, an airflow former and a substrate holding device. The airflow former forms a downward flow of clean air in the inner space of the casing. The development device further includes a plurality of nozzles and a partition mechanism. The plurality of nozzles supply a processing liquid to a substrate held by the substrate holding device. The partition mechanism partitions the inner space of the casing into a processing space and a non-processing space with a substrate held by the substrate holding device. The processing space is a space including a substrate held by the substrate holding device. The partition mechanism includes a cup that receives a processing liquid that splashes from a substrate, a partition plate that has a nozzle opening and a plurality of through holes and is provided above the cup and a cover member that covers the nozzle opening.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.