Photoresist topcoat compositions, comprising: a first polymer comprising a first repeat unit of general formula (I) and a second repeat unit of general formula (II): ##STR00001##
wherein: R.sub.1 independently represents H, F or optionally fluorinated C1 to C4 alkyl; R.sub.2 represents optionally fluorinated linear, branched or cyclic C1 to C20 alkyl; L.sub.1 represents a single bond or a multivalent linking group; and n is an integer of from 1 to 5; a second polymer comprising a first repeat unit of general formula (III) and a second repeat unit of general formula (IV): ##STR00002##
wherein: R.sub.3 independently represents H, F or optionally fluorinated C1 to C4 alkyl; R.sub.4 represents linear, branched or cyclic C1 to C20 alkyl; R.sub.5 represents linear, branched or cyclic C1 to C20 fluoroalkyl; L.sub.2 represents a single bond or a multivalent linking group; and n is an integer of from 1 to 5; and a solvent. Coated substrates coated with the described topcoat compositions and methods of processing a photoresist composition are also provided. The invention finds particular applicability in the manufacture of semiconductor devices.

Photoresist topcoat compositions, comprising: a first polymer comprising a first repeat unit of general formula (I) and a second repeat unit of general formula (II): ##STR00001##
wherein: R.sub.1 independently represents H, F or optionally fluorinated C1 to C4 alkyl; R.sub.2 represents optionally fluorinated linear, branched or cyclic C1 to C20 alkyl; L.sub.1 represents a single bond or a multivalent linking group; and n is an integer of from 1 to 5; a second polymer comprising a first repeat unit of general formula (III) and a second repeat unit of general formula (IV): ##STR00002##
wherein: R.sub.3 independently represents H, F or optionally fluorinated C1 to C4 alkyl; R.sub.4 represents linear, branched or cyclic C1 to C20 alkyl; R.sub.5 represents linear, branched or cyclic C1 to C20 fluoroalkyl; L.sub.2 represents a single bond or a multivalent linking group; and n is an integer of from 1 to 5; and a solvent. Coated substrates coated with the described topcoat compositions and methods of processing a photoresist composition are also provided. The invention finds particular applicability in the manufacture of semiconductor devices.

A spin coater that can be used to apply multiple coating compositions over an optical substrate, is described. The spin coater includes, a coater bowl configured to collect excess coating material expelled from an optical substrate being coated, a rotatable chuck configured to receive and rotate the optical substrate in the bowl during coating, a plurality of coating reservoirs, each containing a coating material, and an indexable coating reservoir platform containing the plurality of reservoirs and configured to index a selected reservoir into a dispensing position above the coater bowl. The spin coater can include or have associated therewith at least one curing station, in which each curing station is independently configured to cure at least partially at least one applied coating material. Each curing station can include at least one of a thermal curing station, a UV curing station, and/or an IR curing station.

A spin coater that can be used to apply multiple coating compositions over an optical substrate, is described. The spin coater includes, a coater bowl configured to collect excess coating material expelled from an optical substrate being coated, a rotatable chuck configured to receive and rotate the optical substrate in the bowl during coating, a plurality of coating reservoirs, each containing a coating material, and an indexable coating reservoir platform containing the plurality of reservoirs and configured to index a selected reservoir into a dispensing position above the coater bowl. The spin coater can include or have associated therewith at least one curing station, in which each curing station is independently configured to cure at least partially at least one applied coating material. Each curing station can include at least one of a thermal curing station, a UV curing station, and/or an IR curing station.

A coating apparatus and method are disclosed for coating tablets with a film, in which the tables transit through a drilled first container where they are coated, then exit the first container and are removed from a rotating element provided on the periphery of a plurality of removal members that are spaced angularly apart from one another, in which each removal member removes a quantity of tablets, raises the removed tables as far as a certain height and then discharges the tablets into a chute that conveys the tablets into a second rotating drilled container, with delicate transfer of the coated tablets from one container to the next.

A spin-on glass (SOG) depositing system includes a suck back (SB) valve arranged to receive SOG. The SOG depositing system further includes a SOG dispenser having a nozzle, the SOG dispenser coupled with the SB valve for receiving SOG. The SOG depositing system further includes a detector positioned to detect SOG outside the nozzle. The SOG depositing system further includes an SB valve controller coupled with the detector for receiving one or more signals from the detector and coupled with the SB valve for controlling operation of the SB valve, wherein the SB valve controller is configured to pause sensing by the detector based on the sensed amount of SOG outside the nozzle being outside at least one operating parameter.

A slotted nozzle for discharging a liquid adhesive to a narrow edge of a substrate includes a nozzle body, a nozzle slot formed in the nozzle body, a passage in the nozzle body for supplying the adhesive to the nozzle slot, and a slot-shaped outlet opening of the nozzle slot. The nozzle body is configured in the region of averted ends of the nozzle slot that are based on the longitudinal extent of the nozzle slot in such a manner that an increased outlet of the adhesive through the outlet opening takes place in the region of the averted ends of the nozzle slot.

A slotted nozzle for discharging a liquid adhesive to a narrow edge of a substrate includes a nozzle body, a nozzle slot formed in the nozzle body, a passage in the nozzle body for supplying the adhesive to the nozzle slot, and a slot-shaped outlet opening of the nozzle slot. The nozzle body is configured in the region of averted ends of the nozzle slot that are based on the longitudinal extent of the nozzle slot in such a manner that an increased outlet of the adhesive through the outlet opening takes place in the region of the averted ends of the nozzle slot.

In one embodiment, a spin coating apparatus includes a coating liquid feeding module to drop a coating liquid onto a substrate, and a motor to rotate the substrate. The module drops a first drop amount of the coating liquid onto the substrate at a first discharge rate, while the motor rotates the substrate at a first number of rotations. The module drops a second drop amount of the coating liquid onto the substrate at a second discharge rate larger than the first discharge rate, while the motor rotates the substrate at a second number of rotations smaller than the first number of rotations, after the first drop amount of the coating liquid is dropped. The module discharges the coating liquid onto the substrate at a third discharge rate smaller than the second discharge rate, after the coating liquid is discharged onto the substrate at the second discharge rate.

In one embodiment, a spin coating apparatus includes a coating liquid feeding module to drop a coating liquid onto a substrate, and a motor to rotate the substrate. The module drops a first drop amount of the coating liquid onto the substrate at a first discharge rate, while the motor rotates the substrate at a first number of rotations. The module drops a second drop amount of the coating liquid onto the substrate at a second discharge rate larger than the first discharge rate, while the motor rotates the substrate at a second number of rotations smaller than the first number of rotations, after the first drop amount of the coating liquid is dropped. The module discharges the coating liquid onto the substrate at a third discharge rate smaller than the second discharge rate, after the coating liquid is discharged onto the substrate at the second discharge rate.