A dip tank is fillable with a liquid. An accommodation device accommodates components and is rotatingly drivable around an axis of rotation. The accommodation device and the dip tank are movable relative to each other to dip the components in the dip tank or to lift the components out of the dip tank. A splash guard is provided. A lifting device is arranged to move the splash guard relative to the dip tank.

A dip tank is fillable with a liquid. An accommodation device accommodates components and is rotatingly drivable around an axis of rotation. The accommodation device and the dip tank are movable relative to each other to dip the components in the dip tank or to lift the components out of the dip tank. A splash guard is provided. A lifting device is arranged to move the splash guard relative to the dip tank.

A method includes rendering a cleaning nozzle of a spin coating device below a base plate and out of optimal exposure to a bottom surface and edges of a substrate material placed on a spin chuck in a state of engagement of the base plate with the spin chuck, and rendering the base plate completely under the spin chuck even in the aforementioned state of engagement. In response to disengagement of a lid from the base plate, the method also includes disengaging the base plate from the spin chuck to lower the base plate to a locking point whereupon a portion of the cleaning nozzle below the base plate passes through a hole in the base plate and emerges completely out of and above the base plate, and cleaning the bottom surface and/or the edges of the substrate material utilizing the cleaning nozzle based on an optimal exposure thereof.

A method includes rendering a cleaning nozzle of a spin coating device below a base plate and out of optimal exposure to a bottom surface and edges of a substrate material placed on a spin chuck in a state of engagement of the base plate with the spin chuck, and rendering the base plate completely under the spin chuck even in the aforementioned state of engagement. In response to disengagement of a lid from the base plate, the method also includes disengaging the base plate from the spin chuck to lower the base plate to a locking point whereupon a portion of the cleaning nozzle below the base plate passes through a hole in the base plate and emerges completely out of and above the base plate, and cleaning the bottom surface and/or the edges of the substrate material utilizing the cleaning nozzle based on an optimal exposure thereof.

The invention relates to method and apparatus for lining the cathode of the electrolytic cell. The method comprises filling the cell's shell with powder material, leveling it with a rack, covering the fill material with a dust-proof film, and compaction. Compaction is performed in two stages: preliminary static and final dynamic treatment by consequent movement of static and dynamic work tools of compaction along the longitudinal axis of the cathode of the electrolytic cell through a cushion, which is made of at least 2 layers: a lower layer, which prevents pushing powder material forward in the direction of travel, and an upper layer, which provides for a coupling between the cushion and the static work tool. Static treatment unit of the apparatus is designed in the form of a roller with a drive, connected to a dynamic treatment unit with a vibratory exciter by means of elastic elements.

The invention relates to method and apparatus for lining the cathode of the electrolytic cell. The method comprises filling the cell's shell with powder material, leveling it with a rack, covering the fill material with a dust-proof film, and compaction. Compaction is performed in two stages: preliminary static and final dynamic treatment by consequent movement of static and dynamic work tools of compaction along the longitudinal axis of the cathode of the electrolytic cell through a cushion, which is made of at least 2 layers: a lower layer, which prevents pushing powder material forward in the direction of travel, and an upper layer, which provides for a coupling between the cushion and the static work tool. Static treatment unit of the apparatus is designed in the form of a roller with a drive, connected to a dynamic treatment unit with a vibratory exciter by means of elastic elements.

Improved wafer coating processes, apparatuses, and systems are described. In one embodiment, an improved spin-coating process and system is used to form a mask for dicing a semiconductor wafer with a laser plasma dicing process. In one embodiment, a spin-coating apparatus for forming a film over a semiconductor wafer includes a rotatable stage configured to support the semiconductor wafer. The rotatable stage has a downward sloping region positioned beyond a perimeter of the semiconductor wafer. The apparatus includes a nozzle positioned above the rotatable stage and configured to dispense a liquid over the semiconductor wafer. The apparatus also includes a motor configured to rotate the rotatable stage.

A substrate processing apparatus processes a substrate. The substrate processing apparatus includes at least one processing unit that processes the substrate, first and second cameras that image different subject areas, and an association processing unit that generates association information indicating association between each of the subject areas and each of the first and second cameras by processing an image captured by each of the first and second cameras.

Machine for applying sealing material to a metal element comprises at least one electromagnetic mandrel provided with a main body to house at least one electromagnet and a support to hold the metal element in position on a work surface following the excitation of the electromagnet; the main body is connected to drive means configured to make the support rotate on the work surface; the delivery device of the sealing material is positioned at least in proximity to the periphery of the metal element and is able to deliver sealing material when the metal element is held in position and made to rotate on the work surface by means of the support of the electromagnetic mandrel.

A wafer cup including a copolymer containing a tetrafluoroethylene unit and a fluoro(alkyl vinyl ether) unit. A water contact angle of at least a part of an inner surface of the wafer cup is 80 degrees or less.