B05C11/1002

Systems and methods of controlling adhesive application
11618051 · 2023-04-04 · ·

Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.

Dispensing system

A dispensing system can include a material delivery assembly that includes a tubular reservoir with a tubular extension, where the tubular reservoir includes a longitudinal axis; a nozzle body, where the tubular extension fluidly couples the tubular reservoir to the nozzle body; and a rotor coupling that operatively couples to the material delivery assembly for rotation of the tubular reservoir about its longitudinal axis.

ROTARY DISPENSING TANK
20230191441 · 2023-06-22 ·

A dispensing system for a rotary dispensing machine includes a tank, a fill tube, and a piston that moves along the fill tube and defines an air chamber and a fluid chamber within the tank. The tank is rotatable relative to the fill tube. A fluid is dispensed from the fluid chamber of the tank through at least one outlet formed in the tank.

FIELD-CONFIGURABLE, EXCHANGEABLE, AND REVERSIBLE EXTRUDER ASSEMBLY FOR A FLUID APPLICATION SYSTEM

An extruder assembly may include an entry die, an exit die, and one or more shims. The exit die can be coupled with a fluid applicator system with the entry die facing away from a body of the system to direct adhesive flowing into the exit die, through the shims, and out of the exit die, the entry die, and the shims onto a web or strand moving in a first direction. The entry die may be coupled with the body of the system with the exit die facing away from the body to direct the adhesive onto a web or strand moving in a second, opposite direction.

Hot-glue application system and method for controlling and monitoring the hot-glue application system
09840643 · 2017-12-12 · ·

In the hot-glue application system with a melter and components connected thereto, such as one or more heatable feeder pipes and one or more heatable application valves, the components contain a machine-readable and preferably also machine writable data storage medium.

BATCH COATING APPARATUS AND BATCH COATING METHOD

Some embodiments of the disclosure describe a batch coating apparatus. In some examples, the batch coating apparatus includes a fixing mechanism, a liquid holding mechanism, a liquid injection mechanism and a control device. The fixing mechanism includes a plurality of fixing portions for fixing work-pieces to be coated. The liquid holding mechanism includes a plurality of liquid tanks arranged side by side. The liquid injection mechanism includes a liquid storage portion and an infusion portion. The control device is configured to control at least one of a relative movement between the fixing mechanism and the liquid holding mechanism and a relative movement between the liquid holding mechanism and the liquid injection mechanism. The control device is configured to control the liquid injection mechanism to supply the coating liquid via the infusion portion.

Apparatus and process for face painting substrates with PGM and base metal solutions

The principles and embodiments of the present invention relate generally to systems and methods for applying a catalytic coating to the outwardly facing edges of the cell walls of a catalytic substrate to reduce the amount of soot that accumulates at the entrances of the substrate cells that can increase back pressure and reduce the flow of exhaust gases through the substrate.

APPARATUS AND METHOD OF SUPPLYING CHEMICAL LIQUID AND SUBSTRATE TREATING APPARATUS

Provided is an apparatus for supplying a chemical liquid, the apparatus including: a storage tank in which a chemical liquid is stored; a discharge line through which the chemical liquid stored in the storage tank is discharged; a level tube connected to the storage tank so as to check a water level of the chemical liquid in the storage tank and receiving the chemical liquid at the same water level as the water level of the chemical liquid in the storage tank; and a controller for controlling a first valve installed in the discharge line, in which the level tube has one end connected to an upper space of the storage tank and the other end connected to the discharge line.

ROBOTIC COATING SYSTEM WITH REAL-TIME MIXING
20230182166 · 2023-06-15 ·

A Robotic Coating System with Real-Time Mixing has a particular arrangement of a robotic gantry, two peristaltic pumps, a mixer, a hollow brush, two tanks, and a computerized controller. The invention has tubes providing fluid communication from a coating tank and a thinner tank through the pumps and mixer to the brush. The invention provides everything necessary for robotic coating in one compact system. This invention provides the ability to apply coatings to an item, without pre-mixing the coating components. A computerized controller drives the brush through a pre-programmed path to coat required areas and not coat sensitive areas. The System operates upon utility service, typically 110 VAC, and it also self-cleans.

METHOD AND APPARATUS FOR TREATING SUBSTRATE
20170341106 · 2017-11-30 ·

Provided is a method and apparatus for treating a substrate with a liquid. The substrate treating method comprises a pre-treating step for supplying the treatment liquid containing hydrogen fluoride (HF) to the substrate and treating the substrate before the surface modification step and a surface modification step for supplying an alkene-based chemical onto a substrate to change the surface of the substrate to a hydrophobic state. As a result, the surface of the substrate is uniform, and generation of particles can be reduced when the substrate is removed.