Disclosed is an apparatus for treating a substrate, the apparatus including: an outer cup having a treatment space with an open top; a support unit for supporting a substrate in the treatment space; a guide cup disposed in the treatment space and arranged to surround the support unit; a liquid supply unit for supplying a treatment liquid to a top surface of the substrate supported by the support unit; and a trap ring disposed in a gap between the guide cup and the outer cup to capture the treatment liquid flowing through the gap, in which the trap ring is formed with an exhaust hole through which gas flowing through the gap passes, and the trap ring has a capture space for capturing the treatment liquid on a top surface thereof.

Methods for storing and moving adhesive particulate to an adhesive melter are disclosed. An interior space of a supply hopper is filled with adhesive particulate. A transfer pump is actuated to generate a vacuum at an inlet of the transfer pump to actuate removal of the adhesive particulate from the supply hopper. A consistent minimized depth of the adhesive particulate located directly above the inlet is maintained with a shroud located within the interior space of the supply hopper. In addition, adhesive particulate can be received in an interior space of a container. An open space is maintained within the interior space of the container proximate the pump inlet, where the open space entrains gas to be drawn by the transfer pump. The transfer pump can be actuated to generate a vacuum at the pump inlet to cause removal of the adhesive particulate from the container.

A resin dispensing apparatus includes a supply unit including a syringe having an internal space configured to hold a phosphor-containing resin. An agitator is disposed in the internal space. The supply unit is configured to rotate at least one of the syringe and the agitator to prevent settling of phosphor contained in the phosphor-containing resin. A discharge unit includes a cylinder having a discharge nozzle through which the phosphor-containing resin, received through a connecting pipe connected to the syringe, is discharged. A piston provides pressure to discharge the phosphor-containing resin through the discharge nozzle inside the cylinder.

A coating device for sealant and a coating method for sealant coating are disclosed. The coating device includes a sealant storage pipe provided with two end portions; one end portion is connected to a gas jet means and the other end portion is connected to a nozzle; a pipe wall of the sealant storage pipe is made from a flexible material; and the pipe wall can be subjected to recoverable inward deformation perpendicular to an axial line of the sealant storage pipe. A coating method for sealant coating, comprising: subjecting a pipe wall to recoverable inward deformation perpendicular to an axial line of a sealant storage pipe during spraying; and subjecting the pipe wall to recovery when the spraying ends.

An adhesive bin (10) for storing and moving adhesive particulate (14) to an adhesive melter (12) includes a supply hopper (16), a transfer pump (62) operable to generate a vacuum, and a shroud (94). The supply hopper (16) has a sidewall (20, 22, 24, 26) and defines an interior space (36). The transfer pump (62) extends through the sidewall (22) and into the interior space (36). In addition, the shroud (94) is connected to the sidewall (22) and extends into the interior space (36) and at least partially surrounds an inlet (82) of the transfer pump (62).

A coating die includes a manifold, a supply port, a discharge port, a supply passage, and a discharge passage. The manifold, the discharge passage, and the discharge port are longer in a first direction, and an outline of the manifold viewed from a second direction includes a first outline part to which the discharge passage is connected and also includes a second outline part located opposite the first outline part. The second outline part includes a first taper part tilted to be closer to the first outline part toward an end of the manifold. When the dimension in the first direction from a connection part at which the supply passage is connected in the manifold to the end is set to 1, dimension ratio of the first taper part in the first direction is 0.4 or less.

An application apparatus includes a nozzle device (20) injecting a damping material from a nozzle hole (20a) to a vehicle body, an articulated robot (21) moving the nozzle device (20) relative to the vehicle body, a supply section including a supply pump (22), and a supply passage (27), and continuously driving the supply pump (22) to continuously supply the damping material from the supply pump (22) to the supply passage (27) in a substantially uniform amount, a return passage (33) branched from the supply passage (27) and returning the damping material to the supply pump (22), and a gun (32) and a return valve (34) switching a supply destination of the damping material between the nozzle hole (20a) and the return passage (33) based on information on applying the damping material to the vehicle body.

An electrode slurry transfer system, including: a mixer storage tank for storing an electrode slurry discharged from a mixer; a first transfer tank for storing a high temperature slurry and connected to the mixer storage tank by a first transfer pipe branched in parallel; a second transfer tank for storing a low temperature slurry and connected to the mixer storage tank by a first transfer pipe branched in parallel; a coater supply tank configured to receive a high temperature slurry and a low temperature slurry from the first and second transfer tanks, respectively, and to supply an electrode slurry mixture thereof to a coater; a flow rate regulating portion configured to regulate a transfer flow rate of a high temperature slurry introduced into the coater supply tank from the first transfer tank, and a transfer flow rate of a low temperature slurry introduced into the coater supply tank from the second transfer tank, respectively; and a control portion for controlling a temperature of the electrode slurry in the coater supply tank.

According to one embodiment, a processing liquid supply device includes a plurality of tanks, a supply path that supplies a processing liquid to a processing device, a heating unit that heats the processing liquid, a dilution unit that dilutes the processing liquid, a new-liquid supply unit that supplies a new liquid, a common flow path through which the processing liquid of the plurality of tanks passes, a switching unit that switches between the plurality of tanks so that at least a tank is selected from which the processing liquid passes to the common flow path, a densitometer provided in the common flow path, and a control device that controls at least one of the heating unit, the dilution unit, and the new-liquid supply unit so that the concentration reaches a target value set in advance.

A hot melt adhesive supply system includes a container configured to receive a supply of unmelted hot melt adhesive pieces, and an agitation device configured to agitate the supply of hot melt adhesive pieces situated in the container. The hot melt adhesive supply system further includes a transfer conduit configured to communicate hot melt adhesive pieces from the container to a hot melt adhesive melter.