A composite flock material including a base layer comprising a hot melt adhesive, an elastic adhesive layer disposed on a top surface of the hot melt adhesive, and a plurality of flock fibers potted into the elastic adhesive layer is disclosed. The composite flock material is stretchable up to 20% from an initial unstretched length while maintaining the structural integrity of the composite flock material. Methods of producing a composite flock material are also disclosed.

An inorganic polymer coating. Low cost thermal barrier coatings thermal barrier coating and a process that starts with an aqueous suspension which may be sprayed, dipped, rolled or painted on a surface and cured. The cured thermal barrier coating has high thermal performance, low emissivity, high adhesion to multiple substrates, thermal cycle and thermal shock stability, high hardness, high elasticity and toughness.

The present invention relates to a two-coat two-bake powder coating structure and application method thereof that mainly utilizes high concentrated migratory pigment and dye powder in the primer layer that osmotically diffuses into the finish layer of colorless powder during baking after the finish layer undergoes the electrostatic spray process. The principle is to apply a second baking process to the migratory pigment and dye powder, causing the molecular chains of the primer layer to become loose. As a result, the small molecules of the migratory pigment and dye powder can uniformly move from the primer layer into the finish layer across the interface between the primer layer and the finish layer through osmosis and diffusion. After the finish layer cools down, the migratory pigment and dye powder is solidified within the finish layer so that the chromatic aberration of the surface coating layer is improved.

A weatherable, low heat build-up, UV-cured vacuum coating for PVC or other extruded plastic profiles comprising a dark-colored pigment system that is substantially IR transparent, an IR reflective substrate, and a vacuum coating system for same.

Invention concerning a method for the production of a multilayer matte coated surface, where the carrier (1) is covered with a layer of coating (4) containing an additive to increase the bond strength of the coating between the layers. The coating layer is exposed to excimer radiation with a wavelength of 172 nm and afterwards treated with an electron beam with the dose required to achieve the gelatinisation of the coating, or with UV radiation in order to obtain an adequate gelatinisation effect. A least one other layer of coating with bond strength improving additive is applied to the first layer, which is again exposed to excimer radiation and an electron beam or UV radiation with the same dose as for the first layer. if the second layer is the outer layer, i.e. the last layer (6), the entire surface is treated with an electron beam with the dose required to finish the polymerisation process of all coating layers, or is treated with appropriate UV radiation, in order to achieve an adequate hardening effect.

The invention concerns also a furniture product containing a multilayer matte coated surface obtained with the method according to the invention.

An initiated chemical vapor deposition (i-CVD) method for forming a nanovoided polymeric material may include heating a mixture including a gaseous monomer, a gaseous polymerization initiator, and a solvent to form a polymeric thin film including the solvent and removing the solvent from the polymeric thin film to form a nanovoided thin film. Devices, including dielectric elastomer actuators, may be formed using the nanovoided polymeric material. Various other methods, systems, apparatuses, and materials are also disclosed.

Disclosed are silicon and carbon containing film forming compositions comprising a polycarbosilazane polymer or oligomer formulation that consists of silazane-bridged carbosilane monomers, the carbosilane containing at least two —SiH.sub.2— moieties, either as terminal groups (—SiH.sub.3R) or embedded in a carbosilane cyclic compound, wherein R is H, a C.sub.1-C.sub.6 linear, branched, or cyclic alkyl- group, a C.sub.1-C.sub.6 linear, branched, or cyclic alkenyl- group, or combination thereof. Also disclosed are methods of forming a silicon and carbon containing film comprising forming a solution comprising a polycarbosilazane polymer or oligomer formulation and contacting the solution with the substrate via a spin-on coating, spray coating, dip coating, or slit coating technique to form the silicon and carbon containing film.

The present disclosure provides fluid barriers as well as systems and methods of forming fluid barriers. The method includes cleaning, via a blast media, a first side of a component and heating the component to a first temperature. Subsequently, the component is cleaned using a solvent. Subsequent to heating at least the component, a primer coating layer is formed on the first side of the component, and a topcoat layer is formed in contact with the primer coating layer. A primer coating material can be heated to a second temperature prior to formation of the primer coating layer. The first temperature can be different than the second temperature.

The present disclosure provides a thin film material and a manufacturing method thereof. The manufacturing method of the thin film material comprises: a compound A and a first reactant reacting to form a compound B; the compound B and a second reactant reacting to form a compound C; the compound C and a third reactant reacting to form a polymer D; the polymer D reacting to obtain a mixture including a polymer F or a polymer H; and a solution including the polymer F or the polymer H forming the polymer F or the polymer H on a substrate.

A semiconductor package includes: a plurality of unit redistribution layers vertically stacked, each including: a first polymer layer having a first via hole pattern; a second polymer layer formed on the first polymer layer, and having a redistribution pattern on the first polymer layer and a second via hole pattern in the first via hole pattern; a seed layer covering sidewalls and bottom surfaces of the redistribution pattern and the second via hole pattern; a conductive via plug formed in the second via hole pattern; and a conductive redistribution line formed in the redistribution pattern; a connection terminal disposed on a bottom surface of a lowermost unit redistribution layer and electrically connected to the conductive via plug; a semiconductor device mounted on the unit redistribution layers with a conductive terminal interposed therebetween. Upper surfaces of the second polymer layer, the conductive redistribution line and the conductive via plug are substantially coplanar.