Methods for forming a coating can include preparing a nanocomposite film including surface modified silicon dioxide nanoparticles, applying an oxygen plasma treatment to the nanocomposite film to form a treated nanocomposite film, and applying a fluorosilane solution to the treated nanocomposite film to form the coating. A coating can include a nanocomposite film including surface modified silicon dioxide nanoparticles, the nanocomposite film having an oxygen plasma treated surface, and a monolayer of a fluoro alkyl chain.

Methods for forming a coating can include preparing a nanocomposite film including surface modified silicon dioxide nanoparticles, applying an oxygen plasma treatment to the nanocomposite film to form a treated nanocomposite film, and applying a fluorosilane solution to the treated nanocomposite film to form the coating. A coating can include a nanocomposite film including surface modified silicon dioxide nanoparticles, the nanocomposite film having an oxygen plasma treated surface, and a monolayer of a fluoro alkyl chain.

A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.

A composite material includes: a substrate and a polymer layer which are interconnected by an adhesion promoter layer. The adhesion promoter layer is obtainable by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the substrate includes a metal substrate or a polymer substrate.

According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.

This laminated body comprises an organic resin substrate, and single layer of an active energy ray-curable resin layer (i) and an inorganic deposition layer (ii) that are sequentially laminated on the organic resin substrate, wherein a power spectrum obtained by performing Fourier transformation on the wavenumber of a reflected wave spectrum obtained by reflectivity spectroscopy at the layer (i) and plotting the amplitude thereof with respect to the length dimension has, at L.sub.1 and L.sub.2 that are equal to or greater than a length dimension threshold L.sub.0, a first local maximum value S.sub.1 and a second local maximum value S.sub.2, respectively, and when L.sub.0 is defined as an arbitrary value within a range of 1-310.sup.6 m, in a defined range of the power spectrum excluding the range of L.sub.0 or less, the first local maximum value S.sub.1 has a signal-to-noise ratio SI/N of at least 5 with respect to noise N, and the second local maximum value S.sub.2 has a signal-to-noise ratio S.sub.2/N of at least 2 with respect to noise N. The laminated body exhibits, despite the fact that said laminated body has a single intermediate layer composed of an active energy ray-curable film between the organic resin substrate and the inorganic deposition layer, weather fastness and adhesiveness comparable to or better than those of a laminated body having a plurality of thermoset films as intermediate layers.

This laminated body comprises an organic resin substrate, and single layer of an active energy ray-curable resin layer (i) and an inorganic deposition layer (ii) that are sequentially laminated on the organic resin substrate, wherein a power spectrum obtained by performing Fourier transformation on the wavenumber of a reflected wave spectrum obtained by reflectivity spectroscopy at the layer (i) and plotting the amplitude thereof with respect to the length dimension has, at L.sub.1 and L.sub.2 that are equal to or greater than a length dimension threshold L.sub.0, a first local maximum value S.sub.1 and a second local maximum value S.sub.2, respectively, and when L.sub.0 is defined as an arbitrary value within a range of 1-310.sup.6 m, in a defined range of the power spectrum excluding the range of L.sub.0 or less, the first local maximum value S.sub.1 has a signal-to-noise ratio SI/N of at least 5 with respect to noise N, and the second local maximum value S.sub.2 has a signal-to-noise ratio S.sub.2/N of at least 2 with respect to noise N. The laminated body exhibits, despite the fact that said laminated body has a single intermediate layer composed of an active energy ray-curable film between the organic resin substrate and the inorganic deposition layer, weather fastness and adhesiveness comparable to or better than those of a laminated body having a plurality of thermoset films as intermediate layers.

A composite material includes: a metal substrate and a polymer layer which are directly interconnected by an adhesion promoter layer. The adhesion promoter layer is obtained by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the organosilicon compound includes a siloxane, silane, or silicate.

A composite material includes: a metal substrate and a polymer layer which are directly interconnected by an adhesion promoter layer. The adhesion promoter layer is obtained by plasma-enhanced chemical vapor deposition (PE-CVD) at least partially using a mixture of precursor compounds containing an unsaturated hydrocarbon and an organosilicon compound. In an embodiment, the organosilicon compound includes a siloxane, silane, or silicate.

According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.