A dipstick assembly includes a first handle attached to an end of the rod, a second handle including a second handle opening configured to receive the first handle and the rod, and a cleaning pad disposed at the bottom end of the second handle. The cleaning pad is configured to receive the rod and contact the rod to clean the rod when the first handle and rod are moved vertically relative to the second handle and the cleaning pad.

The molded body is a non-foamed molded body including a polyurethane, wherein a Martens hardness measured at a point on the surface of the molded body positioned at a shortest distance from the center of gravity G is 1.0 N/mm.sup.2 or more, and three points of Martens hardness measured in a cross-section of the molded body satisfies a specific relational expression, wherein an index value K.sub.? from a scattering profile obtained by allowing a characteristic X-ray from a Cu tube to incident on a surface region to be evaluated of the molded body satisfies a specific relational expression, and wherein the molded body has an erosion rate E of 0.6 ?m/g or less, which is measured with spherical alumina particles having an average particle diameter (D.sub.50) of 3.0 ?m in the surface region to be evaluated.

The molded body is a non-foamed molded body including a polyurethane, wherein a Martens hardness measured at a point on the surface of the molded body positioned at a shortest distance from the center of gravity G is 1.0 N/mm.sup.2 or more, and three points of Martens hardness measured in a cross-section of the molded body satisfies a specific relational expression, wherein an index value K.sub.? from a scattering profile obtained by allowing a characteristic X-ray from a Cu tube to incident on a surface region to be evaluated of the molded body satisfies a specific relational expression, and wherein the molded body has an erosion rate E of 0.6 ?m/g or less, which is measured with spherical alumina particles having an average particle diameter (D.sub.50) of 3.0 ?m in the surface region to be evaluated.

A self-cleaning surface system, comprising one or more rotatable bodies (19); a support structure (3) supporting the one or more rotatable bodies, wherein the one or more rotatable bodies are configured to rotate with respect to the support structure about a corresponding rotation axis, said one or more rotatable bodies having a corresponding cleanable surface (1) which is parallel to the corresponding rotation axis and being configured to rotate together with the corresponding rotatable body, from facing a first direction to facing a second direction and vice versa, the first direction being opposite to the second direction; a rotation mechanism; a cleaning mechanism comprising a cleaning fluid ejection mechanism; and an activation mechanism, wherein the cleaning fluid ejection mechanism when activated is arranged to eject a cleaning fluid towards said one or more cleanable surfaces when the latter face the second direction.

A self-cleaning surface system, comprising one or more rotatable bodies (19); a support structure (3) supporting the one or more rotatable bodies, wherein the one or more rotatable bodies are configured to rotate with respect to the support structure about a corresponding rotation axis, said one or more rotatable bodies having a corresponding cleanable surface (1) which is parallel to the corresponding rotation axis and being configured to rotate together with the corresponding rotatable body, from facing a first direction to facing a second direction and vice versa, the first direction being opposite to the second direction; a rotation mechanism; a cleaning mechanism comprising a cleaning fluid ejection mechanism; and an activation mechanism, wherein the cleaning fluid ejection mechanism when activated is arranged to eject a cleaning fluid towards said one or more cleanable surfaces when the latter face the second direction.

There is provided a chip sweeping robot which is capable of possessing adaptability to various machine tools and automatically sweeping a wide range efficiently. To this end, a chip sweeping robot configured to sweep chips, which are scattered on an upper surface of a table of a machine tool at the time of machining a workpiece attached to the table, by traveling in accordance with a travel route set on the upper surface, includes: a robot body which autonomously travels on the upper surface; a rotating brush which sweeps the chips out forward in a traveling direction by being rotated from a lower side to an upper side forward in the traveling direction; and a blade which scoops out the chips, which pass through the rotating brush, forward in the traveling direction and sends the chips to a rotating region of the rotating brush.

In some embodiments, methods and systems are provided for improved handling of lithography masks including loading a mask via a first load port from a first carrier; inverting the mask using a first contact pad; cleaning the mask; inverting the mask using a second contact pad; and unloading the mask via a second load port into a second carrier. Numerous other aspects are provided.

A windshield wiper system for an aircraft is provided and includes a motor, an output shaft, a wrap spring and crank rocker mechanism (WSCRM) to which the motor and the output shaft are coupled and a controller. By way of the WSCRM, first directional rotation input to the WSCRM from the motor via a two-stage gear reduction is converted such that the output shaft drives wiper blade oscillation through a first sweep angle and second directional rotation input to the WSCRM from the motor is converted such that the output shaft drives wiper blade oscillation through a second sweep angle. The controller is configured to control the motor such that the first directional rotation is continuously or non-continuously input during first or second flight conditions, respectively, and the second directional rotation is continuously input during third flight conditions.

A photovoltaic (PV) module cleaning system can include a robotic cleaning device and a support system. The support system can be configured to provide a metered fill to the robotic cleaning device. In some embodiments, the robotic cleaning device and include a curved cleaning head. Various techniques for deploying a robotic cleaning device on PV modules include out-and-back, leapfrog, among others.

A system for removing a coating from an underlying layer can include a wave-based weakening system configured to weaken the coating by decreasing a coupling force between the coating and the substrate, a coating removal mechanism configured to remove the weakened coating from the underlying layer, and a sensor configured to determine a property associated with the coating. A method for removing a coating from an underlying layer can include generating a weakened coating and removing the weakened coating.