A pruner cleaning machine scrubs gummy sap and foreign matter from pruner blades inserted into its cleaning chamber. The machine includes a motor turning a drive shaft assembly having scrubbers coupled thereon. The scrubbers have scrubbing surfaces facing each other and a central scrubber element resides between the scrubbers.

A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

A method and system for cleaning an array of solar panels. The system can include an applicator apparatus configured with a plurality of cleaning devices, and an automatic position system (APS) configured with the applicator apparatus. The APS can include a first and second sensor coupled to the applicator apparatus. A controller coupled to the first and second sensor devices can be configured to adjust a position of the applicator apparatus to maintain the plurality of cleaning devices in a direction facing a solar panel to facilitate a removal of an undesired material from the solar panel, while the applicator apparatus is moved from a first position to a second position. A mobile vehicle can he configured with the applicator apparatus to move along a row of the array of solar panels to perform the method for cleaning.

A cleaning tool for cleaning a glass surface of an accelerator column is disclosed. The cleaning tool includes a shaft including a first end and a second end; a foam body located at the first end of the shaft; and a mounting bracket coupled to the first end of the shaft, the mounting bracket receiving the foam body. An outer circumference of the foam body includes a textured cleaning surface for contacting the glass surface of the accelerator column.

Methods and apparatus for cleaning a central venous catheter port are disclosed. An apparatus includes a body, a coupling configured to connect the body to the hub, a cleaning cap coupled to the body, and an actuator disposed within the body for rotating and translating the cap relative to the hub. The cleaning cap includes a cap body defining a cavity and a cleaning member disposed within the cavity, the cleaning member having threads that engage with the threads on the hub.

A method and device for cleaning and pretreating solar panels is provided. The device comprises a brush having cleaning elements made from silicone foam rubber material. The cleaning elements can be flaps of silicone foam rubber material. A sheet of silicone foam rubber material having two free ends can be attached to a core member such that the two free ends extend away from the core member to form flaps. The solar panels can be cleaned by brushing the solar panel surfaces with the flaps of silicone foam rubber material. The solar panels can also be pretreated by brushing the solar panel surfaces with silicone foam rubber material.

A post CMP cleaning apparatus is provided. The post CMP cleaning apparatus includes a cleaning stage. The post CMP cleaning apparatus also includes a rotating platen disposed in the cleaning stage, and the rotating platen is configured to hold and rotate a semiconductor wafer. The post CMP cleaning apparatus further includes a vibrating device disposed over the rotating platen. The post CMP cleaning apparatus further includes a solution delivery module disposed near the vibrating device and configured to deliver a cleaning fluid to the semiconductor wafer. The vibrating device is configured to provide the cleaning fluid with a specific frequency which is at least greater than 100 MHz while the rotating platen is rotating the semiconductor wafer, so that particles on the semiconductor wafer are removed by the cleaning fluid.

An outpouring assembly, comprising an outpouring plate, wherein the outpouring plate is provided with a liquid outlet through hole, a paste discharge pipe is disposed in the liquid outlet through hole, the paste discharge pipe moves up and down in the liquid outlet through hole, and when a lower end of the paste discharge pipe extends out of the liquid outlet through hole, the paste discharge pipe is in a liquid outpouring state. A beneficial effect of the present invention is as follows: Because a liquid such as the color paste or water has surface tension, the color paste adheres to a surface of an outlet, outpouring precision of the outpouring assembly is affected. A paste discharge pipe is disposed in the liquid outlet through hole, so that a quantity of color pastes adhered to a paste discharge outlet of the paste discharge pipe can be effectively reduced.

The powered scrubbing device with telescoping handle accessory includes a handheld, battery-powered scrubbing device and an attachable, telescoping handle. The battery powers a motor that drives a reciprocator, which provides linear reciprocating motion to an attached sponge or brush. The reciprocating speed may be controlled by a user through a button on a body of the device. A scrubbing pad may be removably attachable so it can be replaced when worn out or when a user requires a scrubbing pad having different scrubbing characteristics. The telescoping handle may be attached for accessing hard to reach places with the scrubbing device.

A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.