According to one embodiment of the present disclosure, provided is a substrate cleaning method that performs an operation, in a state where a cleaning member is in contact with a rotating substrate, the cleaning member is moved between a first position on the substrate and a second position close to an edge of the substrate, n times (n is an integer of 2 or more), wherein a controller, which controls a driver that moves the cleaning member, controls the driver to perform an edge cleaning step to perform cleaning of the substrate in a state where the cleaning member is in contact with the second position on the substrate for a predetermined period of time after the cleaning member reaches the second position at least in one operation of the first to the (n-1)th operations.

The cable cleaning and rolling system combines an automated cleaning and winding system for industrial cables and the like with a water filtration system for recycling the water used to clean the cable. The cable cleaning and rolling system includes a hollow base, a feed drum and a receiving drum. The feed drum is adapted for releasably retaining and feeding the cable to be cleaned, and the receiving drum is adapted for receiving and robing the cable after it has been cleaned and dried. At least one nozzle, for spraying cleaning water on the cable, at least one brush, for scrubbing the cable, and a blower, for drying the cable, are positioned between the feed drum and the receiving drum. Waste water from the cleaning is received within the hollow base, extracted therefrom, and delivered to a water filtration unit for recycling.

A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

A flexible composite torsion shaft for attachment to a drive shaft includes an elongated core element having a circular cross section. A reinforcement comprising at least one polymer layer and multiple layers of reinforcing-fiber wound around the core element inside the at least one polymer layer. Each reinforcing-fiber layer is wound around the core element at a winding angle in a range of 40 to the hoop winding angle, depending on a width of a reinforcing-fiber being wound, relative to a longitudinal direction of the core element. At least one reinforcing-fiber-layer is wound at an opposite angle from another reinforcing-fiber layer inside the at least one polymer layer. The winding angle increases as an average layer diameter of reinforcing-fiber insider the at least one polymer layer increases.

A cleaning apparatus and a method of using the cleaning apparatus are provided. The method includes first moving a pencil pad into contact with a top surface of a wafer, wherein the pencil pad is connected to a pivot arm and second moving the pivot arm in a sweeping motion from a first zone to a second zone, the first zone being closer to a center of the top surface of the wafer than the second zone, wherein the sweeping motion is controlled by a controller, the pivot arm moves at a first speed in the first zone and the pivot arm moves at a second speed in the second zone, wherein the first speed is different from the second speed.

A system includes a base defining an opening. The system includes a pair of gaskets supported by the base, the opening disposed between the gaskets. The system includes a pair of pads supported by the base, the gaskets disposed between the pads. The system includes a transparent shield supported by the base and movable between a first position and a second position, the shield abutting one of the pads in the first position and the other of the pads in the second position.

According to one embodiment, a rope cleaning device comprises a scraper ring which engages grooves between strands of a wire rope to scrape out foreign material from the grooves as the wire rope passes through the scraper ring, a wiper ring positioned in series with the scraper ring for wiping the surface of the wire rope as the wire rope passes through the wiper ring and a rotational mechanism which allows the scraper ring to rotate about the axis of the wire rope.

A cleaning device including a covering hood having a lower surface facing a surface to be cleaned and an inlet on an upper surface thereof, through which contaminants are sucked; an air knife provided on a circumference of the covering hood and having an outlet for spraying high pressure air to the surface to be cleaned; a sweeper installed inside the covering hood and rotated by a driving motor to guide foreign objects swept away from the surface to be cleaned and contaminants floated by the high pressure air injection of the air knife to the inlet; a rotary member including a shaft passing through a circumferential surface of the covering hood and the air knife, and a rotary knob coupled to one end of the shaft to rotate the air knife to adjust an air spray angle.

The present disclosure relates generally to an apparatus for cleaning or otherwise treating a floor or ground surface. Devices provided herein include various features to enhance the efficiency and efficacy of cleaning operations. Such devices includes, but are not limited to, bearing protector devices, cord and cable management devices, and ergonomic features useful with ride-on floor treating machines.

A cleaning apparatus for cleaning a cleaning tool that scrub-cleans a substrate includes a cleaning body. The cleaning body includes a contact portion configured to come into contact with the cleaning tool, and the contact portion includes a suction area configured to remove foreign matter from the cleaning tool.