The invention relates to a 3D printer (10) having a coater (30) and a coater-cleaning device (50). The coater (30) has a container (32), which defines an inner hollow space (34) for receiving particulate building material, and a discharge region (36) for discharging the particulate building material, said coater being movable into a cleaning position in which the coater is arranged above the coater-cleaning device (50). The coater-cleaning device (50) has a wiper element (52) for wiping the discharge region (36), said wiper element being formed from an absorbent material which is configured to receive a liquid cleaning agent inside the material.

A method includes cleaning a wafer with a brush element where the brush element collects particles from the wafer during the cleaning process. The brush element is immersed in a first cleaning liquid. An ultrasonic or megasonic vibration is applied to the first cleaning liquid. The ultrasonic or megasonic vibration causes the particles to dislodge from the brush element into the first cleaning liquid. The particles contaminate the first cleaning liquid.

A gas-assisted scraping tool includes a housing having a blade support with a cavity that is connectable to a source of a pressurized gas; a blade attached to and extending forwardly of the blade support; and a diffuser attached to the blade support and spacing the blade from the cavity, the diffuser shaped to direct a stream of the pressurized gas from within the cavity lengthwise along the blade and distribute the pressurized gas transversely across a width of the blade, whereby material loosened by the blade is blown away from an end of the blade by the stream of the pressurized gas.

A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base having a through hole. The semiconductor wafer cleaning apparatus further includes a spindle extending through the through hole. The semiconductor wafer cleaning apparatus also includes a clamping member. The clamping member covers the through hole and connected to the spindle. A gap that communicates with the through hole is formed between the spin base and the clamping member. In addition, the semiconductor wafer cleaning apparatus includes a sealing ring. The sealing ring is positioned adjacent to the gap and located farther away from the spindle than the gap.

New systems, methods and devices for the management of reusable food containers, such as dishes and/or trays, are provided. Systems and devices for managing a large inventory of dishes or trays to be re-used, are provided. A re-usable tray management and processor device is provided. The re-usable tray management and processor device includes a control system, a first, tray-receiving end, a tray conveyor, at least one scanning device(s), a denester/dispenser, a separator and an offloading end, configured to offload soiled reusable food containers to a washing, drying and packing section. Rotary release actuator(s) are included within the denester/dispenser. And a new form of rotary actuator and brush and excavator tool is provided, coupled with each of the rotary release actuators. In some embodiments, the control system plans actions downstream of a pre-cleaning station, based on data received from the scanning device(s).

New systems, methods and devices for the management of reusable food containers, such as dishes and/or trays, are provided. Systems and devices for managing a large inventory of dishes or trays to be re-used, are provided. A re-usable tray management and processor device is provided. The re-usable tray management and processor device includes a control system, a first, tray-receiving end, a tray conveyor, at least one scanning device(s), a denester/dispenser, a separator and an offloading end, configured to offload soiled reusable food containers to a washing, drying and packing section. Rotary release actuator(s) are included within the denester/dispenser. And a new form of rotary actuator and brush and excavator tool is provided, coupled with each of the rotary release actuators. In some embodiments, the control system plans actions downstream of a pre-cleaning station, based on data received from the scanning device(s).

A docking station includes a base and a cleaning member assembly. The cleaning member assembly includes at least one cleaning member, a first bracket, a second bracket, and a power source. Each of the at least one cleaning member is mounted on the first bracket and the second bracket. One of the first bracket and the second bracket is a fixed bracket, and the other is a movable bracket. The movable bracket is driven to reciprocate along a straight line, in order to drive each the cleaning member to swing relative to the first bracket around a central axis.

A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

Provided is disclosure for embodiments providing delivery of chemicals for conditioning a brush offline, where the brush is not coupled to a machine that makes use of the brush to clean a surface of an object.

An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a substrate holder configured to rotate the substrate while holding the substrate with the back surface facing upward; a scrub cleaning tool configured to be rotatable; a two-fluid nozzle disposed above the substrate holder; and a housing defining a cleaning chamber in which the substrate holder, the scrub cleaning tool, and the two-fluid nozzle are located.