A fluid heating device includes a container in which fluid is supplied between an inner surface of an outer cylindrical member and outer surfaces of the inner cylindrical members, lamp heaters arranged in an inner cylindrical members, a nozzle member arranged on a leading end side of the lamp heaters and having an air supply port, and a guide mechanism that guides gas supplied from the air supply port of the nozzle member. The inner cylindrical members include a central inner cylindrical member arranged at a center of the outer cylindrical member, and peripheral inner cylindrical members arranged around the central inner cylindrical member. The lamp heaters include a central lamp heater arranged in the central inner cylindrical member and peripheral lamp heaters respectively arranged in the peripheral inner cylindrical members. The guide mechanism guides the gas to a leading end side of the central lamp heater.

An apparatus for cleaning crustacea or game has a container with an interior volume defined by a wall, a fluid inlet extending into the interior volume of the container, and a plurality of nozzles connected to the fluid inlet. The plurality of nozzles are directed in different directions. The plurality of nozzles are positioned adjacent to the wall of the container so as to direct the fluid from the fluid inlet toward another portion of the wall of the container. The fluid inlet is adapted to pass a fluid under pressure into the interior volume of the container. The plurality of nozzles are arranged one above another.

An apparatus for washing an article includes a container defining an internal chamber configured to receive the article, an inflow connector connectable to a source of pressurized fluid, a filter member disposed within the internal chamber between a base of the container and the inflow connector, and a lid sealingly engagable with an open upper end of the container and defining at least one opening. Pressurized fluid supplied to the internal chamber is urged upwardly through the internal chamber, through and around an article disposed therein, and out the at least one opening of the lid. As a result, salt retained within or on the article is expelled through the at least one opening of the lid and particulate on or within the article is collected or passed through the filter member. Systems incorporating the apparatus and methods of using the same are also provided.

Provided is a substrate cleaning method capable of maintaining a substrate and a cleaning tank in a clean condition after cleaning. In this method, a substrate holder holding the substrate is immersed in a rinsing liquid in the cleaning tank. While a flow of a cleaning liquid is formed on the substrate, the substrate holder and an inner surface of the cleaning tank, the rinsing liquid is discharged from the cleaning tank. While the flow of the cleaning liquid is formed on the substrate, the substrate holder and the inner surface of the cleaning tank, the rinsing liquid is supplied into the cleaning tank, and the substrate holder is immersed in the rinsing liquid. The substrate holder is pulled up from the rinsing liquid.

The present invention relates to a wafer cleaning device which can prevent a cleaning solution from leaking and enables prompt treatment. The present invention provides a wafer cleaning device comprising: a cleaning bath which receives a cleaning solution and from which the cleaning solution overflows according to the dipping of wafers; a plurality of lift parts arranged at the outside of the cleaning bath and dipping the cassette into the cleaning solution in the cleaning bath; an external water tank having the cleaning bath and the lift parts received therein and including a drain hole through which the cleaning solution is drained; and a tray which can be detachably attached to the inner bottom surface of the external water tank and collects the cleaning solution to guide same to the drain hole.

A rinsing bath which can simplify a discharging structure of a rinsing liquid is disclosed. The rinsing bath includes an inner bath for storing the rinsing liquid, an overflow bath configured to receive the rinsing liquid overflowing the inner bath, a stopper for closing a drain hole provided on a bottom of the inner bath, an actuator configured to move the stopper between a closing position in which the stopper closes the drain hole and a opening position in which the stopper is away from the drain hole, a rinsing liquid supply pipe configured to supply the rinsing liquid into the inner bath, and a drain pipe coupled to a bottom of the overflow bath. The drain hole communicates between an inside of the inner bath and an inside of the overflow bath.

A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.

An apparatus for conditioning a component of a processing chamber is provided. A tank for holding a megasonic conditioning solution is provided. A mount holds the component immersed in a megasonic conditioning solution, when the tank is filled with the megasonic conditioning solution. A megasonic conditioning solution inlet system delivers the megasonic conditioning solution to the tank. A megasonic transducer head comprises at least one megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution. A megasonic conditioning solution drain system drains the megasonic conditioning solution from the tank at a location above where the component is held in the megasonic conditioning solution. An actuator moves the megasonic transducer head across the tank.

The disclosure relates to a device for cleaning electronic components and/or circuits. The cleaning device comprises a first vessel containing a liquid, a support for holding the electronic components and/or circuits, a fluid injection system including nozzles allowing the projection of jets of fluid to sweep the surface of the components, and a fluid mixer including a first inlet suitable for receiving a pressurized liquid, a second inlet suitable for receiving a pressurized gas, and an outlet designed to supply the injection system with two-phase fluid. The first inlet is coupled to the outlet by an inner duct, the second inlet is coupled to a pressurized gas supply and to an injector for injecting the gas into the inner duct.

A substrate processing system includes a batch processor, a single-substrate processor, and a transferrer. The batch processor collectively processes a plurality of substrates by immersing the plurality of substrates in ozonated water stored in a processing tank. The single-substrate processor processes the plurality of substrates one by one with a chemical liquid. The transferrer transfers the plurality of substrates in a wet state from the batch processor to the single-substrate processor.