A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

The invention relates to a cleaning apparatus for cleaning, in particular, electrical components with a gaseous cleaning medium, comprising a receiving device to which the component is fixed or fixable, a nozzle device with at least one nozzle element directed or directable at the component, and a holding device for said nozzle element, wherein at least one nozzle element is adapted to at least one contour of the component, in particular an outer contour or an envelope surface, as well as a pressurization device for acting upon the nozzle device with the cleaning medium, wherein at least one nozzle element of the nozzle device is exchangeably and, in particular, releasably fixable or fixed to the holding device, and wherein the cleaning apparatus comprises at least one drive device, which is in operative connection with the component and/or with the nozzle device, for achieving a relative movement of the component and the at least one nozzle element during the cleaning. The invention also relates to a method.

A transport vehicle cleaning device that cleans a transport vehicle incudes a housing including a cleaning space accommodating the transport vehicle for cleaning, a plurality of fans disposed at an upper part of the housing and generating a downward airflow in the cleaning space, a cleaning gas injector disposed at a ceiling of the housing and injecting a cleaning gas towards the transport vehicle in the cleaning space of the housing, an exhaust unit provided at a lower part of the housing and exhausting the cleaning gas supplied to the cleaning space and a foreign matter removed from the transport vehicle from the cleaning space, and a frame cover disposed in the housing and configured to completely cover opposite openings of the frame in the housing to form a closed internal space of the frame separated from the cleaning space.

A filter cleaning system for cleaning a filter element is provided. The filter cleaning system includes a set of pulse nozzles and a compressed air supply, which rotate together during a cleaning cycle to release pulse blasts at predetermined time intervals to clean the filter element.

An air-sourced cleaning and deburring workpiece mechanism includes a fixed frame, a transfer assembly coupled to the fixed frame, and a cleaning assembly. The cleaning assembly includes a drive member, a slide member, and a first cleaning member. The drive member can drive the first cleaning member to move back and forth along a transfer direction of the transfer assembly, so that the first cleaning member can be applied to a workpiece.

A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

A cleaning device for cleaning the inside of a monocrystal pulling apparatus includes a main tube part that is capable of being inserted into a pull chamber and a wire cleaning mechanism that is provided at an upper portion of the main tube part and is configured to clean a pulling wire to be inserted into the main tube part. The main tube part includes a continuous extension mechanism that adds together and joins a plurality of joint tube parts in an axial direction and allows the plurality of joint tube parts to be sealed and connected to each other. Accordingly, the cleaning device is configured to efficiently clean the wire by preventing powdery dust from adhering thereto again.

A device for processing logs, comprises a deicing apparatus (11), a debarking apparatus (22), arranged downstream of the deicing apparatus, a thermal camera (30), arranged to acquire a thermal image of at least one log downstream of the debarking apparatus, and a processing device (40). The processing device (40) is configured to receive the thermal image from the thermal camera, to process the thermal image to determine a log surface temperature, and to provide a deicing control signal to the deicing apparatus (11) based on the log surface temperature. A method of processing logs is also disclosed.

The invention discloses a wheel cleaning and blowing method. A flange plate on a sliding table I ascends from a low position to a high position, a flange plate on a sliding table II descends from a preset high position to the low position. A upper servo motor is started to drive the sliding table I and the sliding table II to move synchronously to the center, the wheel entering a cleaning system is cleaned in all directions. A lower servo motor is started to drive a rotating disk to rotate 180 degrees, the wheel enters a blowing system from the cleaning system. The upper servo motor stops working, the idle sliding table II moves to the initial position of the left station, the sliding table I moves to the initial position of the right station.

The invention relates to a device (1) for the generative production of a three-dimensional object (2) by means of successive layer-by-layer selective solidification of construction material layers consisting of a solidifiable construction material (3), by means of at least one laser beam (5), comprising at least one device (4) for generating at least one laser beam (5) for layer-by-layer selective solidification of individual construction material layers consisting of solidifiable construction material (3), a flow device (9) for generating a fluid flow (10) that flows at least partially through a processing chamber (8) of said device (1), and a detection device (12) for detecting an item of flow information describing at least one physical parameter and/or at least one chemical parameter of the fluid flow (10).