A method for cleaning a semiconductor fabrication equipment part having gas holes used in single-wafer type semiconductor fabrication equipment for processing semiconductor wafers, wherein the semiconductor fabrication equipment part having gas holes is formed of aluminum or an aluminum alloy, and has a distribution plate having a plurality of gas holes, the method including: a step (1) of scanning a gas injection surface of the distribution place, which is a surface facing the wafer, with a laser beam; and a step (2) of bringing the gas injection surface and insides of the gas holes into contact with a cleaning liquid containing an inorganic acid.

A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

Method and apparatus for identifying a contaminant on a substrate. Identification of a contaminant removed from a substrate can be useful in identifying and eliminating or reducing the source of the contamination and tailoring the removal method to minimize the potential for substrate damage. The methods and apparatus for identification of the contaminant provide liberation of molecules of the contaminant from the surface of the substrate, accounting for different geometries and substrate materials, sample preparation, and chemical analysis of the contaminant.

A tool that removes a scale inside a pipe includes: a laser tool including a laser head to output a laser beam, and a robotic arm that is articulated and that is connected to the laser head. The robotic arm includes segments that are connected by flexible robotic arm joints to enable movement of the laser head in six degrees of freedom, and a control system to control the robotic arm to direct output of the laser beam. The tool also includes a drilling shaft attached to the robotic arm of the laser tool.

An automated or manual laser ablation system and method of use to enable safe, non-user-contact, rapid, and remote cleaning of industrial tubular equipment, e.g. heat-exchangers and reactors. The laser ablation system comprises: a fiber optic cable (12) with a laser probe output end (20), connected to an optics unit (5 or 6) enclosed within a laser probe housing (14). The optics unit comprises: a double convex and/or one or two plano-convex lens; and an Axicon prism, mirror cone, and/or galvo-scanning mirror to emit a rotating or a fixed circular beam. The laser beam cleans a plurality of reactor tubes' internal wall to cause the evaporation of deposit buildups and rust. The laser ablation system further comprises: an air vacuum system (30) positioned to cool the ablation system while removing the debris to a vacuum generator (35); and/or a push motor (60) that pushes and pulls the system through the tubes.

A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

In one embodiment, systems and methods include using an automated laser system to remove a portion of a coating for nutplate installation. An automated laser system comprises a laser scanner and a laser head, wherein the laser head is coupled to the laser scanner. The laser head comprises a containment unit and a vacuum connector wherein the vacuum connector is disposed on a first side of the containment unit. The laser head further comprises a camera system, a light source, a first actuator, and a second actuator all disposed on a top surface of the containment unit. The laser head further comprises an end piece, wherein the second actuator is configured to displace the end piece.

Provided are a laser cavitation composite ultrasonic cleaning device and cleaning method for a connecting rod, which belong to the technical field of bushing gap cleaning of engine connecting rods. Provided are a laser cavitation composite ultrasonic cleaning device and cleaning method for a connecting rod, the cleaning device comprises a cleaning tank, a bracket, a low-frequency ultrasonic vibrator, a first laser head, and a second laser head; the low-frequency ultrasonic vibrator is located on an outer side of a bottom portion of the cleaning tank; the first laser head is located above the bracket, and the second laser head is located at a lower portion in the cleaning tank. According to the cleaning device, laser light is combined with an ultrasonic wave, cooperated with light path assemblies, and the laser light is focused in a bolt hole and a bushing gap of the connecting rod.

In one embodiment, systems and methods include using an automated laser system to remove a portion of a coating for nutplate installation. An automated laser system comprises a laser scanner and a laser head, wherein the laser head is coupled to the laser scanner. The laser head comprises a containment unit and a vacuum connector wherein the vacuum connector is disposed on a first side of the containment unit. The laser head further comprises a camera system, a light source, a first actuator, and a second actuator all disposed on a top surface of the containment unit. The laser head further comprises an end piece, wherein the second actuator is configured to displace the end piece.

The subject-matter of the present invention is a method and an apparatus for collectively treating the surfaces of a plurality of objects.