A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The method for cleaning a reflective photomask includes placing a photomask in a first chamber, and performing a dry cleaning operation on the photomask in the first chamber, wherein the dry cleaning operation includes providing hydrogen radicals to the first chamber, generating hydrocarbon gases as a result of reactions of the hydrogen radicals, and removing the hydrocarbon gases from the first chamber.

Provided are a method of selectively etching a film primarily containing Si, such as polycrystalline silicon (Poly-Si), single crystal silicon (single crystal Si), or amorphous silicon (a-Si) as well as a method for cleaning by removing a Si-based deposited and/or attached matter inside a sample chamber of a film forming apparatus, such as a chemical vapor deposition (CVD) apparatus, without damaging the apparatus interior. By simultaneously introducing a monofluoro interhalogen gas (XF, where X is any of Cl, Br, and I) and nitric oxide (NO) into an etching or a film forming apparatus, followed by thermal excitation, it is possible to selectively and rapidly etch a Si-based film, such as Poly-Si, single crystal Si, or a-Si, while decreasing the etching rate of SiN and/or SiO.sub.2. It is also possible to perform cleaning by removing a Si-based deposited and/or attached matter inside a film forming apparatus, such as a CVD apparatus, without damaging the apparatus interior.

An apparatus for performing heat treatment with respect to a substrate is provided. The apparatus for treating the substrate includes a substrate support member to seat a substrate on the substrate support member, a treating bowl to surround the substrate support member, a base plate provided to face a bottom surface of the substrate seated on the substrate support member, and an edge nozzle member mounted on the base plate to spray a treating liquid to a bottom edge part of the substrate seated on the substrate support member. The edge nozzle member includes a main body mounted on the base plate, a nozzle arm to mount an edge nozzle on the nozzle arm to slidably move on the main body, and a fixing member to maintain the nozzle arm at a setting position on the main body.

A pipe snow removal device is supported for movement longitudinally along a pipe to clear snow and/or ice from the pipe. A main housing has boundary walls defining an outer boundary of a bounded space within a hollow interior of the main housing. An inner boundary of the bounded space is open to the pipe upon which the main housing is supported. A mounting arrangement supports the main housing relative to a work vehicle that is movable alongside the pipe to displace the main housing along the pipe. A heater heats the bounded space to melt the snow/ice on the pipe. A scraper assembly supported in leading relationship to the main housing clears loose snow before melting remaining snow and ice on the pipe as the housing passes.

Systems, methods, and devices for post-processing additively manufactured objects are disclosed herein. In some embodiments, a method includes receiving a plurality of additively manufactured objects having excess material thereon. The method can include removing the excess material from the plurality of additively manufactured objects by rotating the plurality of additively manufactured objects. The method can also include adjusting an environmental temperature while rotating the plurality of additively manufactured objects according to a dynamic temperature profile that facilitates removal of the excess material from the plurality of additively manufactured objects. The dynamic temperature profile can include (a) a first temperature configured to decrease a viscosity of the excess material, and (b) a second temperature configured to increase a stiffness of the plurality of additively manufactured objects.

Systems, methods, and devices for post-processing additively manufactured objects are disclosed herein. In some embodiments, a system includes a plurality of containers configured to receive a plurality of additively manufactured object having excess material thereon. The system can include a rotor having a central shaft and a plurality of arms, each arm having a first end and a second end opposite the first end. The first end of each arm can be coupled to the central shaft and a second end of each arm can be coupled to a respective container of the plurality of containers. The system can also include an actuator configured to spin the rotor so as to remove the excess material from the plurality of additively manufactured objects. The system can further include at least one heat source carried on the rotor to heat the excess material to decrease a viscosity thereof.

A device for a plasma processing chamber includes a base, an upper portion attached to the base and extending transverse to the base, and one or more first through holes defined in the base. The one or more first through holes correspond to one or more openings defined in the plasma processing chamber for attaching the device. The device further includes a second through hole defined in the upper portion, and a gauge located in the second through hole, the gauge configured for recording a position of the plasma processing chamber and a shift in the position of the plasma processing chamber.

The present disclosure relates to a cleaning device and an aerosol-generating, and an aerosol-generating system including the same. Since the cleaning device according to an embodiment may receive electrical energy wirelessly from the aerosol-generating device, the cleaning device may operate without an internal battery or a wired power connection. Therefore, a weight of the cleaning device and its manufacturing cost may be reduced, and a user does not need to charge the cleaning device regularly.

A method for manufacturing a laminated iron core product includes laminating a plurality of iron core members which are punched from a first metal plate to form a laminate, removing oil adhering to the laminate, removing oil adhering to an end surface plate which is punched from a second metal plate, and disposing the end surface plate on an end surface of the laminate and welding the end surface plate and the laminate.

A method for cleaning a reflective photomask, a method of manufacturing a semiconductor structure, and a system for forming a semiconductor structure are provided. The method for cleaning a reflective photomask includes placing a photomask in a first chamber, and performing a dry cleaning operation on the photomask in the first chamber, wherein the dry cleaning operation includes providing hydrogen radicals to the first chamber, generating hydrocarbon gases as a result of reactions of the hydrogen radicals, and removing the hydrocarbon gases from the first chamber.