A cleaning device and a cleaning method for surfaces (22) in an application space (20) comprising at least a removal means (4) for application of a cleaning fluid (7) and/or for the removal of adhesions from the surfaces (22), and at least one positioning means (12) of the cleaning device (1) in the application space (20). According to the invention, the positioning means (12) is connected with a control means (1), which comprises a storage device (1), and with the at least one removal means (4) such that cleaning parameters stored in the storage device of the control means can be assigned to a position, and are transferred by the control means to the removal means (4), and the cleaning parameters, when the position is reached, are applied to the removal means (4).

A cleaning apparatus includes a nozzle assembly and an arm supporting the nozzle assembly. In some embodiments, the arm includes a first rotatable arm member defining a first axis and a second rotatable arm member defining a second axis and connected to the first rotatable member. In certain examples, the first rotatable arm is rotatable about the first axis and the second rotatable arm is rotatable about the second axis. The cleaning apparatus also includes at least one sensor on the arm and configured to detect a position of the nozzle assembly based on rotation of the first rotatable arm or the second rotatable arm

A cleaning apparatus includes a nozzle assembly and an arm supporting the nozzle assembly. In some embodiments, the arm includes a first rotatable arm member defining a first axis and a second rotatable arm member defining a second axis and connected to the first rotatable member. In certain examples, the first rotatable arm is rotatable about the first axis and the second rotatable arm is rotatable about the second axis. The cleaning apparatus also includes at least one sensor on the arm and configured to detect a position of the nozzle assembly based on rotation of the first rotatable arm or the second rotatable arm

The invention generally relates to systems and methods for continuous or batch wise sampling of a surface for analysis of trace chemical constituents that may be present on the surface by mass spectrometry. Integration of time and place of the sampling and analysis processes allows real-time on-the-spot response to the analytical data and can take into account that material is not necessarily uniformly distributed on a surface. A further feature of the systems and methods of the invention is that the swabbing process also cleans the surface being analyzed. Accordingly, systems and methods of the invention provide an integrated approach that allows for a surface to be cleaned, sampled and analyzed in real-time, providing a faster and more efficient way to verify or validate whether a manufacturing vessel is sufficiently clean to start another production.

The invention generally relates to systems and methods for continuous or batch wise sampling of a surface for analysis of trace chemical constituents that may be present on the surface by mass spectrometry. Integration of time and place of the sampling and analysis processes allows real-time on-the-spot response to the analytical data and can take into account that material is not necessarily uniformly distributed on a surface. A further feature of the systems and methods of the invention is that the swabbing process also cleans the surface being analyzed. Accordingly, systems and methods of the invention provide an integrated approach that allows for a surface to be cleaned, sampled and analyzed in real-time, providing a faster and more efficient way to verify or validate whether a manufacturing vessel is sufficiently clean to start another production.

In some variations, this invention provides an electro-mechanical device for automated cleaning validation of a selected surface. The device moves a wetted swab over a cleaned surface to recover any remaining soil left over from the cleaning process. The device accepts a standard sampling swab that has been wetted with the required liquid solution. The device maintains constant swab pressure to ensure maximum recovery of soil or contaminants. The device includes an electronic controller for adjusting the movement of parts to effectively validate cleaning of the selected surface. The surface to be validated may be a substantially flat surface, or rounded. The surface may be contained within a vessel, reactor, a pipe, tank, or other equipment. The device may be disposed on an extension arm to allow the device to be positioned appropriately, without the need for a person to be close to the device for validation.

Disclosed is a method for inspecting bundles, wherein receiving containers equipped with containers are transported by a first transport device and wherein the containers each have a marking in their bottom regions which unambiguously identifies the containers, wherein an image recording device records at least one image of the bottom regions of the containers located in the receiving container and at least one information is output which is characteristic of the markings arranged on the containers and/or of at least one property of the containers.

Disclosed is a method for inspecting bundles, wherein receiving containers equipped with containers are transported by a first transport device and wherein the containers each have a marking in their bottom regions which unambiguously identifies the containers, wherein an image recording device records at least one image of the bottom regions of the containers located in the receiving container and at least one information is output which is characteristic of the markings arranged on the containers and/or of at least one property of the containers.

A plasma processing method for plasma-etching a sample in a metallic processing chamber includes etching the sample with a plasma; plasma-cleaning the processing chamber with a fluorine-containing gas after etching the sample; and plasma-processing the processing chamber with a gas containing sulfur and oxygen after plasma cleaning the processing chamber.

A plasma processing method for plasma-etching a sample in a metallic processing chamber includes etching the sample with a plasma; plasma-cleaning the processing chamber with a fluorine-containing gas after etching the sample; and plasma-processing the processing chamber with a gas containing sulfur and oxygen after plasma cleaning the processing chamber.