A method for cleaning substrates in which at least one nozzle arrangement is provided opposite to an exposed surface of a substrate to be cleaned. The nozzle arrangement includes at least two separate nozzles each having a sonic transducer arranged to introduce sonic energy into a liquid media flowing through the respective nozzle towards the surface of the substrate that is to be cleaned in such way that the sonic energy is directed towards the substrate surface. The sonic transducers have different resonant frequencies of the type that at least their respective first and second order harmonics are all different. A liquid media is applied to a surface area of the substrate by flowing liquid media through the at least two separate nozzles of the nozzle arrangement. The nozzles are arranged and positioned with respect to the surface of the substrate such that the media streams of the nozzles at least partially intersect each other prior to reaching the surface of the substrate. Sonic energy is introduced into the liquid flowing through the respective nozzles via the respective transducers such that interference of the frequencies provided by the respective transducers occurs above the surface of the substrate.

A process of using a chemical gel cleaning formulation to clean a cooling tower fill, comprising the steps of applying a pre-rinse fluid to the fill; applying the chemical gel cleaning formulation to the fill, wherein the chemical gel cleaning formulation includes glycerin, at least one polysaccharide, at least one corrosion inhibitor, at least one surfactant, and at least one acid; applying a descaling fluid to the fill; applying a neutralizer solution to the fill to neutralize the pH of residual fluid on the fill surface; and rinsing the fill with a rinsing fluid to remove residual chemical gel cleaning formulation and descaling fluid, residual neutralizer solution, and dissolved deposits from the fill.

A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

Provided is a cavitation processing apparatus for providing cavitation effects such as residual stress evenly on the surface and inner part of the component. The cavitation processing appratus includes: a nozzle that ejects cavitation fluid to a workpiece; a direction changing member that changes a flow direction of the cavitation fluid that collided with the workpiece to be branched toward inside; a driving apparatus including a rotary shaft, the driving apparatus that rotates the workpiece together with the rotary shaft; and a support member supporting one end of the rotary shaft.

A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

A method for cleaning an object includes steps of delivering a cleaning medium to a surface of the object, delivering ultrasonic waves to the object to atomize the cleaning medium, and applying a vacuum airflow to collect atomized cleaning medium.

Disclosed herein is a sonic cleaning insert. In one example, the sonic cleaning insert includes a carousel configured to rotate about a central axis. The carousel further includes a platform having an outer perimeter. The platform is radially disposed about the central axis. The carousel has an inner ring and an outer ring circumscribing the inner ring. A plurality of partitions couple the inner ring and the outer ring to the platform. The plurality of partitions are arranged at a predetermined angle about the central axis. The carousel further includes a plurality of holders. Each holder is formed from a portion of the platform, a portion of each of the inner ring and outer ring, and a first sidewall and a second sidewall formed from the plurality of partitions. The carousel is configured for immersion in an ultrasonic vibrating fluid.

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

A cleaning module for cleaning a wafer comprises a wafer gripping device configured to support a wafer in a vertical orientation and comprises a catch cup and a gripper assembly. The catch cup comprises a wall that has an annular inner surface that defines a processing region and has an angled portion that is symmetric about a central axis of the wafer gripping device. The gripper assembly comprises a first plate assembly, a second plate assembly, a plurality of gripping pin, and a plurality of loading pin. The gripping pins are configured to grip a wafer during a cleaning process and the loading pins are configured to grip the wafer during a loading and unloading process. The cleaning module further comprises a sweep arm coupled to a nozzle mechanism configured to deliver liquids to the front and back side of the wafer.

An electrodischarge apparatus has a nozzle that includes a discharge chamber that has an inlet for receiving a liquid and an outlet. The apparatus has a first electrode extending into the discharge chamber that is electrically connected to one or more high-voltage capacitors. A second electrode is proximate to the first electrode to define a gap between the first and second electrodes. A switch causes the one or more capacitors to discharge across the gap between the electrodes to create a plasma bubble which expands to form a shockwave that escapes from the nozzle ahead of the plasma bubble.