An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

The invention relates to methods for restoring well productivity and to devices for cleaning downhole mesh filters without disassembling water-lifting equipment. Well productivity is restored and maintained using an acoustic method based on generating an ultrasonic fluid flow directed at a filter to clean the pre-filter zone of clogging deposits by moving an acoustic emitter along the filter. The acoustic emitter is placed within the lower portion of a casing string, downstream of a submersible downhole pump, and is connected to a means for delivering thereof into the filter zone. The acoustic emitter device comprises an ultrasonic transducer block, which is disposed between two supporting plates and is connected therewith by a rotary unit and an electric motor. The ultrasonic transducer block is configured in the form of two ultrasonic vibration systems located inside separate cylindrical housings positioned transverse to the axis of the filter, while the working surfaces of the waveguide tools of the vibration systems are oriented in the opposite directions toward the inside surface of the filter. The rotary unit and electric motor are connected to the ultrasonic transducer block and are mounted on the upper and lower supporting plates, respectively. The faces of the supporting plates are perpendicular to the filter axis and have bracing elements along the perimeter for anchoring inside the filter. The electric motor is used to facilitate rotary oscillations of the ultrasonic transducers within a 180-degree range (similar to a clock pendulum). In this case, the waveguide tools sweep the inner surface of the filter with an ultrasonic fluid flow along the circumference of the filter within a 360-degree range. Concurrently with this process, the delivery means causes the acoustic emitter to perform reciprocating movement along the filter axis, thus, providing a subsequent treatment of the entire inner surface of the downhole filter with a directed ultrasonic fluid flow, as well as a regular cleaning of the pre-filter zone of the well without disassembling the water-lifting string and submersible pump.

A megasonic cleaner includes a water tank that includes a pair of opposite inner walls and a bottom wall connected thereto, and that accommodates a fluid therein; a plurality of supporting units arranged in the water tank at predetermined positions that support a wafer; and at least one transducer arranged on the bottom wall that transmits energy in the form of waves into the fluid, where each of the opposite inner walls has a first protrusion that protrudes into an internal space of the water tank, the first protrusion being spaced above the bottom wall and positioned at an height that is greater than or equal to a height of the centers of the plurality of supporting units.

An ultrasonic water jet apparatus includes a water accumulation part in which the water supplied from a water supply source is temporarily accumulated, a jet port that jets the water accumulated in the water accumulation part, and a piezoelectric vibration plate including a dome part that is disposed opposed to the jet port in the water accumulation part and propagates the ultrasonic vibration to the water accumulated in the water accumulation part, a flange part that projects outward in the radial direction from a peripheral edge of the dome part, and an annular plate that projects outward in the radial direction from a peripheral edge of the flange part.

A method for cleaning an object having a surface, the method including steps of (1) delivering acoustic waves to the object to dislodge debris from the surface; (2) delivering a cleaning medium to the surface to collect dislodged debris; (3) delivering the acoustic waves to the object to acoustically treat and atomize the cleaning medium and the dislodged debris; (4) applying a vacuum airflow to collect atomized cleaning medium and dislodged debris; (5) delivering a rinsing medium to the surface; (6) delivering the acoustic waves to the object to acoustically treat and atomize the rinsing medium; and (7) applying the vacuum airflow to collect atomized rinsing medium.

A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle (102) connecting with a carrier (101); a megasonic/ultrasonic device (105) fixing on the carrier (101); and a sensor (104) detecting the distance between the megasonic/ultrasonic device (105) and the carrier (101) to determine whether the megasonic/ultrasonic device (105) is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.

The present invention provides a new filter cleaning method that has cleaning performance superior to that of ultrasonic cleaning. The method for cleaning a filter of the present invention includes the steps of: generating a shock wave; and bringing the shock wave into contact with a filter to which a filler adhered, wherein in the shock wave contacting step, a pressure applied to the filter by the shock wave is 0.07 MPa or more.

A system for cleaning an object may include an acoustic device configured to deliver acoustic waves to the object, a cleaning medium dispenser configured to deliver a cleaning medium to a surface of the object, a rinsing medium dispenser configured to deliver a rinsing medium to the surface, a vacuum configured to deliver a vacuum airflow proximate the surface, wherein the acoustic waves generate acoustic vibrations in the object to dislodge debris from the surface, acoustically treat the cleaning medium and the rinsing medium, and atomize the cleaning medium, the debris collected by the cleaning medium and the rinsing medium.

A substrate processing apparatus includes: a removing part configured to remove liquid droplets present in a recess; a drain hole located at the bottom of the recess of a nozzle head, and configured to discharge the liquid droplets as a target to be removed out of the recess; and a controller configured to control the discharge state of a gas discharge nozzle such that there is a period in which a gas is discharged from the gas discharge nozzle at a flow rate, at which the gas discharged does not reach a surface to be processed of the substrate, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.

A substrate processing apparatus includes: a removing part configured to remove liquid droplets present in a recess; a drain hole located at the bottom of the recess of a nozzle head, and configured to discharge the liquid droplets as a target to be removed out of the recess; and a controller configured to control the discharge state of a gas discharge nozzle such that there is a period in which a gas is discharged from the gas discharge nozzle at a flow rate, at which the gas discharged does not reach a surface to be processed of the substrate, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.