An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

An ultrasonic cleaning apparatus includes: an ultrasonic vibrator (11); a liquid storage part (12) provided in contact with the ultrasonic vibrator; an inflow port (12a) that makes a cleaning liquid (13) flow in the liquid storage part; and an outflow port (12b) that makes the cleaning liquid flow out of the liquid storage part. A contact surface (11a), of the ultrasonic vibrator, which comes into contact with the cleaning liquid, is disposed lower than each of the inflow port and the outflow port.

A pulse jet liquid gas cleaning system has an ultrasonic transducer operable to transform a high-pressure stream of cryogenic fluid from a cryogenic fluid supply into pulsed jets of individual cryogenic fluid slugs.

An ultrasonic apparatus for cleaning component surfaces (40) by means of a transporting liquid in which ultrasonic waves can be transported, the apparatus including an inlet (6) mounted on a body for filling the transporting liquid into the body, an ultrasonic oscillator (3) in the body for producing ultrasonic waves, a feed in the body for guiding the transporting liquid from the inlet (6) directly to the ultrasonic oscillator (3), so that the ultrasonic waves can be introduced into the transporting liquid and the liquid can be transported, an outlet (7) connected to the feed for discharging the transporting liquid which transports the ultrasonic waves from the body, so that a directed cleaning jet is produced. In addition, a holding device for such an ultrasonic apparatus is provided.

A megasonic processing apparatus matches the fundamental resonant or higher-level harmonic frequencies of megasonic thickness-mode transducers to the fundamental resonant or higher-level harmonic frequencies of a plate or other mounting structure upon which the transducers are mounted. The multifrequency transducers are piezoelectric transducers operating in thickness mode at different operating frequencies. The thickness of the mounting plate at the transducer locations is selected to provide a resonant or harmonic frequency matched to that of its corresponding transducer. Two or more megasonic transducers are bonded to the same radiating surface.

An integrated liquidjet system capable of stripping, prepping and coating a part includes a cell defining an enclosure, a jig for holding the part inside the cell, an ultrasonic nozzle having an ultrasonic transducer for generating a pulsed liquidjet, a coating particle source for supplying coating particles to the nozzle, a pressurized liquid source for supplying the nozzle with a pressurized liquid to enable the nozzle to generate the pulsed liquidjet to sequentially strip, prep and coat the part, a high-voltage electrode and a ground electrode inside the nozzle for charging the coating particles, and a human-machine interface external to the cell for receiving user commands and for controlling the pulsed liquidjet exiting from the nozzle in response to the user commands.

An ultrasonic cleaner is provided. The ultrasonic cleaner includes: a first ultrasonic vibrator configured to generate a first ultrasonic wave; a first oscillator configured to drive the first ultrasonic vibrator; a wash tank configured to store a detergent solution; and an attenuation mechanism configured to damp vibration of the wash tank. The wash tank includes a parabolic surface which is a recessed surface facing a vibration surface of the first ultrasonic vibrator, and is configured to reflect the first ultrasonic wave to a focal position where an object to be cleaned is placed. The vibration of the wash tank is generated by the first ultrasonic wave impinging on the wash tank.

An ultrasonically pulsating high-pressure fluid jet coupled with a suction system serve as a tissue harvesting device. The pulsated fluid jet disrupts tissue, permitting both harvesting of cells for therapeutic delivery, and as a surgical dissector and aspirator, for liposuction, soft tissue dissection, etc. The jet is delivered to the target tissue through a cannula, coupled to an aspiration system. An ultrasonically actuated rod vibrates within the cannula engaging a nozzle, disrupting the fluid jet into droplets, permitting tuning of the jet to the resonant frequencies and impact pressures necessary to dissociate the target tissue. A suction recovery system may be separated or integrally formed with the fluid jet cannula, and is linked by a closed tubing system appropriate for sterilization and subsequent delivery of the harvested cells/tissues with or without growth factor or matrix addition for human re-implantation or for in vitro expansion for later re-implantation.

An ultrasonically activated water ejector includes a cylindrical water reservoir section configured to temporarily hold water, an ejection nozzle that ejects the water from a lower part of the water reservoir section, a dome-shaped ultrasonic vibration plate disposed in an upper part of the water reservoir section, facing the ejection nozzle, and having a concave spherical surface on a lower side thereof, and a water supply portion having a supply inlet configured to supply the water along the concave spherical surface into the water reservoir section from an outer periphery toward a center of the ultrasonic vibration plate. The water is supplied from the supply inlet to the water reservoir section in an amount greater than the water to be ejected from the ejection nozzle. The water flows along the concave spherical surface from the outer periphery toward the center, and is held in the water reservoir section.

A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.