Patent classifications
B22F1/107
Self-supporting structures having active materials
A method and system for manufacturing and using a self-supporting structure in processing unit for adsorption or catalytic processes. The self-supporting structure has greater than 50% by weight of the active material in the self-supporting structure to provide an open-celled structure providing access to the active material. The self-supporting structures, which may be disposed in a processing unit, may be used in swing adsorption processes and other processes to enhance the recovery of hydrocarbons.
Electrically conductive paste and sintered body
An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.
Electrically conductive paste and sintered body
An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.
HIGH-TEMPERATURE COMPONENT
A high-temperature component made of a refractory metal or a refractory metal alloy, includes a coating for increasing thermal emissivity. The coating is formed substantially of tungsten and rhenium, i.e. of at least 55 wt. % rhenium and at least 10 wt. % tungsten, and has a Re3W phase of at least 35 wt. %. A process for producing a high-temperature component having a coating for increasing thermal emissivity, is also provided.
HIGH-TEMPERATURE COMPONENT
A high-temperature component made of a refractory metal or a refractory metal alloy, includes a coating for increasing thermal emissivity. The coating is formed substantially of tungsten and rhenium, i.e. of at least 55 wt. % rhenium and at least 10 wt. % tungsten, and has a Re3W phase of at least 35 wt. %. A process for producing a high-temperature component having a coating for increasing thermal emissivity, is also provided.
PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.
METHOD OF PRODUCING SILVER FINE PARTICLES
A method of producing silver fine particles includes continuously reducing silver ions contained in a silver compound to precipitate silver fine particles by introducing at least two fluids from separate flow paths and mixing the fluids, wherein one fluid of the at least two fluids contains the silver compound, and another fluid contains a reducing agent, and at least one fluid of the at least two fluids contains an amino acid. With this method, silver fine particles can be produced with sufficient continuous productivity and quality uniformity, without problems of deterioration of working environment and generation of explosive fulminating silver due to the use of a large amount of ammonia.
METHOD OF PRODUCING SILVER FINE PARTICLES
A method of producing silver fine particles includes continuously reducing silver ions contained in a silver compound to precipitate silver fine particles by introducing at least two fluids from separate flow paths and mixing the fluids, wherein one fluid of the at least two fluids contains the silver compound, and another fluid contains a reducing agent, and at least one fluid of the at least two fluids contains an amino acid. With this method, silver fine particles can be produced with sufficient continuous productivity and quality uniformity, without problems of deterioration of working environment and generation of explosive fulminating silver due to the use of a large amount of ammonia.
BONDING SHEET AND BONDED STRUCTURE
A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.
BONDING SHEET AND BONDED STRUCTURE
A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.