According to the present disclosure, there is provided a method for smoothing a surface of an additively manufactured metal part. The method comprises applying a chemical to a stepped surface of an additively manufactured part to at least soften a binder material supporting unprocessed powder particles of the part and allowing the powder particles at the surface to flow under the influence of gravity into recesses defined by the stepped surface to thereby reduce a roughness of the surface. Advantageously, it has been found that the afore-described method is able to provide a part having an improved surface smoothness.

According to the present disclosure, there is provided a method for smoothing a surface of an additively manufactured metal part. The method comprises applying a chemical to a stepped surface of an additively manufactured part to at least soften a binder material supporting unprocessed powder particles of the part and allowing the powder particles at the surface to flow under the influence of gravity into recesses defined by the stepped surface to thereby reduce a roughness of the surface. Advantageously, it has been found that the afore-described method is able to provide a part having an improved surface smoothness.

A method for the manufacture of a three-dimensional object using a refractory matrix material is provided. The method includes the additive manufacture of a green body from a powder-based refractory matrix material followed by densification via chemical vapor infiltration (CVI). The refractory matrix material can be a refractory ceramic (e.g., silicon carbide, zirconium carbide, or graphite) or a refractory metal (e.g., molybdenum or tungsten). In one embodiment, the matrix material is deposited according to a binder-jet printing process to produce a green body having a complex geometry. The CVI process increases its density, provides a hermetic seal, and yields an object with mechanical integrity. The residual binder content dissociates and is removed from the green body prior to the start of the CVI process as temperatures increase in the CVI reactor. The CVI process selective deposits a fully dense coating on all internal and external surfaces of the finished object.

Methods using formulations for processing a manufactured metal or metal-alloy object, in particular a metal or metal-alloy object manufactured by an additive manufacturing process, are disclosed. Methods, systems and equipment for using the formulations to remove excess materials from the surface, remove support materials, and/or modify the surface of a metal or metal-alloy manufactured object are also disclosed.

The present disclosure provides a method of manufacturing a surface nanotube array of a laser-melted stainless steel, including a step of an anodic oxidation treatment on the stainless steel, which includes performing the anodic oxidation treatment on the stainless steel by applying a voltage between the stainless steel as an anode and a graphite as a cathode in a solution formed by using sodium dihydrogen phosphate, perchloric acid, and ethylene glycol as a solute, and deionized water as a solvent.

The present disclosure provides a method of manufacturing a surface nanotube array of a laser-melted stainless steel, including a step of an anodic oxidation treatment on the stainless steel, which includes performing the anodic oxidation treatment on the stainless steel by applying a voltage between the stainless steel as an anode and a graphite as a cathode in a solution formed by using sodium dihydrogen phosphate, perchloric acid, and ethylene glycol as a solute, and deionized water as a solvent.

An electronic device characterized by including a substrate, a bonding layer provided on the substrate, the bonding layer containing copper in an amount of greater than 0 mass % but 60 mass % or less, the copper having its crystal grain size of 50 nm or less, an electronic component provided on the bonding layer, and a coating film covering a side of the bonding layer, the coating film containing at least one compound selected from copper (I) oxide (Cu.sub.2O) and copper (II) oxide (CuO).

An electronic device characterized by including a substrate, a bonding layer provided on the substrate, the bonding layer containing copper in an amount of greater than 0 mass % but 60 mass % or less, the copper having its crystal grain size of 50 nm or less, an electronic component provided on the bonding layer, and a coating film covering a side of the bonding layer, the coating film containing at least one compound selected from copper (I) oxide (Cu.sub.2O) and copper (II) oxide (CuO).

A Ti—Zr alloy in powder form is described. Sintered pellets containing the Ti—Zr alloy powder of the present invention, as well as capacitor anodes, are further described.

A Ti—Zr alloy in powder form is described. Sintered pellets containing the Ti—Zr alloy powder of the present invention, as well as capacitor anodes, are further described.