Patent classifications
B22F7/004
FABRICATION OF OBJECTS HAVING DIFFERENT DEGREE OF SOLIDIFICATION AREAS
According to examples, an apparatus may include a fabricating system, a processor, and on memory on which are stored machine readable instructions. The instructions, when executed by the processor, may cause the processor to control the fabricating system to spread a first layer of build material as part of an object fabrication process, the build material comprising particles or a paste. The instructions may also cause the processor to control the fabricating system to selectively solidify a first area of the layer to a higher degree of solidification than a predefined second area encompassed by the first area, in which the predefined second area has a lower fracture toughness than the first area to propagate a crack in the object more readily than the first area.
FABRICATION OF OBJECTS HAVING DIFFERENT DEGREE OF SOLIDIFICATION AREAS
According to examples, an apparatus may include a fabricating system, a processor, and on memory on which are stored machine readable instructions. The instructions, when executed by the processor, may cause the processor to control the fabricating system to spread a first layer of build material as part of an object fabrication process, the build material comprising particles or a paste. The instructions may also cause the processor to control the fabricating system to selectively solidify a first area of the layer to a higher degree of solidification than a predefined second area encompassed by the first area, in which the predefined second area has a lower fracture toughness than the first area to propagate a crack in the object more readily than the first area.
RESIN IMPREGNATION METHOD, METHOD OF MANUFACTURING WAVELENGTH-CONVERSION MODULE, AND WAVELENGTH-CONVERSION MODULE
A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.
RESIN IMPREGNATION METHOD, METHOD OF MANUFACTURING WAVELENGTH-CONVERSION MODULE, AND WAVELENGTH-CONVERSION MODULE
A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.
METHOD FOR PRODUCING AN OPEN-PORED METAL BODY HAVING AN OXIDE LAYER AND METAL BODY PRODUCED BY SAID METHOD
An open-pored metal body, which is formed having a core layer (A) consisting of Ni, Co, Fe, Cu, Ag or an alloy formed having one of said chemical elements, wherein one of said chemical elements is present in the alloy at more than 25 at %, and a gradated layer (B) is formed on surfaces of the core layer (A), said gradated layer being formed by intermetallic phase or mixed crystals of Al, and a layer (C), which is formed having aluminum oxide, is formed on the gradated layer (B).
DIRECT PRINTING AND WRITING USING UNDERCOOLED METALLIC CORE-SHELL PARTICLES
A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered structure.
ASYMMETRY COMPOSITE MATERIAL
The present application relates to an asymmetry composite material and a method for preparing the same, which provides a composite material comprising a metal porous body (metal foam or the like) and a polymer component, and provides a method for preparing a composite material, wherein the polymer component is formed in an asymmetrical structure on both sides of the metal porous body (metal foam or the like), and a composite material prepared in such a manner.
Gas turbine hot part and gas turbine
A gas turbine hot part includes: a body portion; a porous portion forming at least a part of the body portion or disposed on at least a part of the body portion and allowing a cooling gas to pass therethrough; and at least one filter disposed upstream of the porous portion in a flow direction of the cooling gas and capable of trapping foreign substances that cannot pass through the porous portion.
Multilayered sintered plate and manufacturing method thereof
A manufacturing apparatus 1 has a leveler 3 which, while pulling out a steel plate starting with one end thereof and while transporting it, corrects the waviness and the like of the steel plate, which serves as a backing plate 2 and is constituted by a continuous strip having a thickness of 0.3 to 2.0 mm and provided as a hoop material by being wound into a coil shape.
WALL DEPOSITION
A method of forming a wall structure on a substrate comprises depositing, by additive-layer, powder-fed, laser-weld deposition apparatus, a plurality of material layers overlying one another on the substrate to form the wall structure. Each material layer of the plurality of material layers has (a) a layer thickness, measured in a direction locally perpendicular to a profile of the substrate, of no greater than about 350 μm and (b) a layer width, measured in a direction locally parallel to the profile of the substrate, of no greater than about 1200 μm.