A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170 C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170 C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

The present disclosure is directed to methods of preparing permanent magnets having improved coercivity and remanence, the method comprising: (a) homogenizing a first population of particles of a first GBM alloy with a second population of particles of a second alloy to form a composite alloy preform, the first GBM alloy being represented by the formula: AC.sub.bR.sub.xCo.sub.yCu.sub.dM.sub.z, the second alloy being represented by the formula G.sub.2Fe.sub.14B, where AC, R, M, G, b, x, y, and z are defined; (b) heating the composite alloy preform particles to form mixed alloy particles; (c) compressing the mixed alloy particles, under a magnetic field of a suitable strength to align the magnetic particles with a common direction of magnetization and inert atmosphere, to form a green body; (d) sintering the green body; and (e) annealing the sintered body. Embodiments include magnets comprising neodymium-iron-boron core alloys, including Nd.sub.2Fe.sub.14B.

The present disclosure is directed to methods of preparing permanent magnets having improved coercivity and remanence, the method comprising: (a) homogenizing a first population of particles of a first GBM alloy with a second population of particles of a second alloy to form a composite alloy preform, the first GBM alloy being represented by the formula: AC.sub.bR.sub.xCo.sub.yCu.sub.dM.sub.z, the second alloy being represented by the formula G.sub.2Fe.sub.14B, where AC, R, M, G, b, x, y, and z are defined; (b) heating the composite alloy preform particles to form mixed alloy particles; (c) compressing the mixed alloy particles, under a magnetic field of a suitable strength to align the magnetic particles with a common direction of magnetization and inert atmosphere, to form a green body; (d) sintering the green body; and (e) annealing the sintered body. Embodiments include magnets comprising neodymium-iron-boron core alloys, including Nd.sub.2Fe.sub.14B.

A magnetic core includes alloy phases 20 each made of Fe-based soft magnetic alloy grains including M1 (wherein M1 represents both elements of Al and Cr), Si, and R (wherein R represents at least one element selected from the group consisting of Y, Zr, Nb, La, Hf and Ta), and has a structure in which the alloy phases 20 are connected to each other through a grain boundary phase 30. In the grain boundary phase 30, an oxide region is produced. The oxide region includes Fe, M1, Si and R and further includes Al in a larger proportion by mass than the alloy phases 20.

A magnetic core includes alloy phases 20 each made of Fe-based soft magnetic alloy grains including M1 (wherein M1 represents both elements of Al and Cr), Si, and R (wherein R represents at least one element selected from the group consisting of Y, Zr, Nb, La, Hf and Ta), and has a structure in which the alloy phases 20 are connected to each other through a grain boundary phase 30. In the grain boundary phase 30, an oxide region is produced. The oxide region includes Fe, M1, Si and R and further includes Al in a larger proportion by mass than the alloy phases 20.

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170 C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170 C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

A powder magnetic core containing a magnetic particle of an Fe-based Cr-containing amorphous alloy and an organic binding substance is provided as a powder magnetic core with a small loss and high initial permeability. The depth profile of the composition determined from the surface of the magnetic particle in the powder magnetic core has the following characteristics. (1) An oxygen-containing region with an O/Fe ratio of 0.1 or more can be defined from the surface of the magnetic particle, and the oxygen-containing region has a depth of 35 nm or less from the surface. (2) A carbon-containing region with a C/O ratio of 1 or more can be defined from the surface of the magnetic particle, and the carbon-containing region has a depth of 5 nm or less from the surface. (3) The oxygen-containing region has a Cr-concentrated portion with a bulk Cr ratio of more than 1.

A powder magnetic core containing a magnetic particle of an Fe-based Cr-containing amorphous alloy and an organic binding substance is provided as a powder magnetic core with a small loss and high initial permeability. The depth profile of the composition determined from the surface of the magnetic particle in the powder magnetic core has the following characteristics. (1) An oxygen-containing region with an O/Fe ratio of 0.1 or more can be defined from the surface of the magnetic particle, and the oxygen-containing region has a depth of 35 nm or less from the surface. (2) A carbon-containing region with a C/O ratio of 1 or more can be defined from the surface of the magnetic particle, and the carbon-containing region has a depth of 5 nm or less from the surface. (3) The oxygen-containing region has a Cr-concentrated portion with a bulk Cr ratio of more than 1.