Disclosed is a method for preparing vanadium or vanadium alloy powder from a vanadium-containing raw material through a shortened process, including: calcinating a mixture of a vanadium-containing raw material and an alkali compound for oxidation to form a water-soluble vanadate; purifying the vanadate followed by vanadium precipitation to produce an intermediate CaV.sub.2O.sub.6 with high purity; dissolving CaV.sub.2O.sub.6 in a molten-salt medium together with other raw materials to form a uniform reaction system; and introducing a reducing agent to the system followed by separation, washing and drying to produce vanadium or vanadium alloy powder having a particle size of 50-800 nm and a purity of 99.0 wt % or more. The method can continuously process vanadium-containing raw materials to prepare vanadium or vanadium alloy powder.

The present invention addresses the problem of providing a conductive paste that achieves both low resistance and high adhesion strength (die shear strength) of the resulting conductive body after firing.

The present invention provides a conductive paste comprising: (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm; (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper particles (A) of 1.0 to 2.0; and (C) a solvent.

The present invention addresses the problem of providing a conductive paste that achieves both low resistance and high adhesion strength (die shear strength) of the resulting conductive body after firing.

The present invention provides a conductive paste comprising: (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm; (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper particles (A) of 1.0 to 2.0; and (C) a solvent.

The present disclosure is directed to methods of preparing substantially spherical metallic alloyed particles, having micron and sub-micron (i.e., nanometer)-scaled dimensions, and the powders so prepared, as well as articles derived from these powders. In particular embodiments, these metallic alloyed particles, complising rare earth metals, can be prepared in sizes as small 80 nm in diameter with size variances as low as 2-5%.

A method of forming a metal nanomaterial comprises forming a precursor solution comprising a metal precursor and a metal oxide precursor. A complexing agent is added to the precursor solution, and the metal precursor and the metal oxide precursor are hydrolyzed to form a sol. The sol is heated to form a gel, which is calcined to incorporate metal cations from the metal precursor into a metal oxide lattice from the metal oxide precursor. The calcined gel is exposed to a reducing agent to exsolve the metal from the metal oxide lattice and to form a metal nanomaterial comprising a metal and a metal oxide is formed. Additional methods of forming a metal nanomaterial are also disclosed.

The disclosure relates to methods and compositions for direct printing of composite components. Specifically, the disclosure relates to the continuous printing of colored resin and metallic composite components using inkjet printing.

A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.

A metal paste for low temperature bonding at temperatures 600° C. or lower, the metal paste comprising: a metal particle with an average particle size of 1 to 100 μm; a metal nanoparticle with an average particle size of 1 to 500 nm; a stress relieving material; and a dispersion medium to disperse the metal particle, metal nanoparticle, and the stress relieving material.

Method for manufacturing an aluminium alloy part by additive manufacturing comprising a step in which a layer of a mixture of powders is locally melted then solidified, wherein the mixture of powders comprises: first particles comprising at least 80 wt. % aluminium and up to 20 wt. % one or more additional elements, and second particles of ZrSi.sub.2, the mixture of powders comprising 1.8 wt. % to 4 wt. % second particles.

The present disclosure relates to an Ag paste composition and a bonding film produced using same, the Ag paste composition being coated on a first object, and the first object being pressure sintered toward a second object side, thereby forming a sintered bonding layer between the first object and the second object, wherein the Ag paste composition comprises 90˜99 wt % of Ag powder, and 1˜10 wt % of an organic binder. The present disclosure controls the specific surface area and grain shape of the Ag powder, even without applying a spherical nanoparticle powder, and thus has the advantages of lowering a bond temperature and increasing bond density, thereby enabling the improvement of bond strength and reliability.