A method loading powder into a mold can include immersing the mold comprising one or more microchannels into a suspension comprising the powder and a surfactant suspended in a dispersant, wherein the powder comprises particles having an average particle size of less than 100 m, wherein the mold is substantially entirely covered by the suspension; heating the suspension having the mold immersed therein under a temperature condition suitable to lower the stability of the particles of the powder in the suspension such that the particles settle out of solution and into the one or more microchannels; and applying an ultrasonic wave to the heated suspension to further settle the particles of the powder into the one or more microchannels thereby filling the one or more microchannels of the mold with the powder.

One object of the present invention is to provide fine copper particles which are less likely to be deteriorated by oxidation in the atmosphere without being coated with an antioxidant or the like and which can be sintered at a lower temperature. The present invention provides fine copper particles wherein an entire surface is covered with a coating film containing cuprous oxide and having an average film thickness of 1.5 nm or less.

A liquid composition includes copper particles, an organic acid, and a solvent. The copper particle has a particle size of 0.5 m30 m which falls in a micron scale. The liquid composition performs reaction sintering by redox reactions taken place between the copper particles and an organic acid solution at a low temperature of 150 C. in order to produce a dense copper layer and improve the conventional micron-scale copper particles that requires a protective atmosphere for the high-temperature sintering before achieving the required densification. This liquid composition also prevents an excessive oxidation of the nano copper particles during the low-temperature sintering process and a failure of the dense sintering. Due to the agglomeration of nano copper particles, some areas have to be sintered first, so that the sintered products have a good uniformity of tissue and a low resistance below 0.04 ohm per square (/).

An AlTeCuZr alloy sputtering target, comprising 20 at % to 40 at % of Te, 5 at % to 20 at % of Cu, 5 at % to 15 at % of Zr and the remainder of Al, wherein a Te phase, a Cu phase and a CuTe phase are not present in a structure of the target. An object of the present invention is to provide an AlTeCuZr alloy sputtering target capable of effectively reducing particle generation, nodule formation and the like upon sputtering and further capable of reducing oxygen contained in the target.

The present invention relates to a new pre-alloyed metal based powder, intended to be used in surface coating of metal parts. The powder is deposited using e.g. laser cladding or plasma transfer arc welding (PTA), or thermal spray (e.g. HVOF). The powder is useful for reducing friction and improving wear reducing properties of the deposited coating. Such coatings may also improve machinability. As friction or wear reducing component, inclusions of manganese sulphide or tungsten sulphide in the pre-alloyed powder may be used.

A lead-free solder alloy composition includes a lead-free solder alloy; and a flower-shaped metal nano-particle including a metal core and protrusion portions extending from a surface of the metal core, wherein the metal core and the protrusion portions of the metal nano-particle include only one metal element.

A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

The present invention provides among other things silver nanoparticles and methods of making the same. The nanoparticles may be sulfidated to decrease the silver leaching rate and sustain the biocidal properties. Such nanoparticles may be applied as a coating or additive to substrates such as metals, alloys, polymers, membranes, textiles, and other such materials, allowing for the substrates to exhibit antimicrobial properties.

A novel silver-coated copper powder, particularly a silver-coated copper powder particle having a dendritic shape, having increased electrical conductivity with no need to increase the silver content is provided. The silver-coated copper powder is composed of a silver-coated copper particle coated with a silver layer containing silver or a silver alloy, including a silver-coated copper particle having a dendritic shape, containing nitrogen (N) in the silver layer, and having a nitrogen (N) content of 0.2 to 10.0 parts by mass with respect to 100 parts by mass of the silver content.

The present invention is a method of producing highly crystalline silver microparticles by a reduction reaction, which comprises precipitating the silver microparticles by reacting a silver solution containing at least silver ions and a reducing agent solution containing at least a reducing agent by a continuous wet reduction method, wherein a reduction rate from the silver solution to the silver microparticles is 99% or more; an average primary particle diameter of the silver microparticles is 100 nm or more and 1,000 nm or less; and an average crystallite diameter relative to the average primary particle diameter of the silver microparticles is 80% or more. Even highly crystalline silver microparticles having 95% or more of the ratio (d/D) of the average crystallite diameter (d) relative to the average primary particle diameter (D), that is, silver microparticles in which almost all silver microparticles are single crystals, can be continuously produced by a liquid phase method, by the present invention.