A cutting tool according to this invention includes a cutting edge configured to cut a workpiece; a rake surface configured to come in contact with a chip, which appears when the workpiece is cut by the cutting edge; and a relieved surface configured to come in contact with a to-be-cut surface of the workpiece. A plurality of first grooves are formed on a cutting edge side of the rake surface. The plurality of first grooves includes a plurality of aligned grooves arranged adjacent to each other, and a connection groove connecting at least two of the plurality of aligned grooves to each other.

An insert of the present disclosure includes a first surface, a second surface connecting to the first surface, and a cutting edge located on at least a part of a ridgeline between the first surface and the second surface. The first surface includes, at a position away from the ridgeline, a groove extending from a first end part closest to the cutting edge to a second end part farthest away from the cutting edge. The groove includes an opening located in the first surface, and a bottom surface. The groove includes, at a position closer to the first end part than a half of a groove length, a first groove part where a groove depth increases as going from the second end part toward the first end part, and a second groove part where the groove depth decreases as going from the second end part toward the first end part. The first groove part is located closer to the second end part than the second groove part. A cutting tool of the present disclosure includes the insert.

In one aspect, cutting tools are provided comprising radiation ablation regions defining at least one of refractory surface microstructures and/or nanostructures. For example, a cutting tool described herein comprises at least one cutting edge formed by intersection of a flank face and a rake face, the flank face formed of a refractory material comprising radiation ablation regions defining at least one of surface microstructures and surface nanostructures, wherein surface pore structure of the refractory material is not occluded by the surface microstructures and surface nanostructures.

A turning insert includes a top surface, an opposite bottom surface, a side surface connecting the top and bottom surfaces, and a cutting edge formed at an intersection between the top surface and the side surface. The cutting edge including a corner cutting edge, a first cutting edge, and a second cutting edge. The top surface having a first surface in the form of a depression, which borders at least a major portion of the corner cutting edge. The first and the second cutting edges subtending an angle which is 75-85. At least a part of the corner cutting edge is concave in a front view.

A device for mechanically removing material from a workpiece or bulk feedstock, thereby creating chips of removed material while producing a new surface on the workpiece or bulk feedstock. The device comprises a body and at least one round cutting insert that is tangentially mounted on the body. Location and orientation of the insert is characterized by a reference plane offset and an insert axis angle. The insert has an outwardly-facing rake surface on which chips are formed. A planar flank surface is oriented relative to a cutting motion so as to provide clearance between the cutting insert and the surface created by removal of a layer that is converted into chips. A circular cutting edge lies at the intersection of the flank and rake surfaces.

The edge portion includes an upper surface, a side surface, and a land surface. The side surface has a front side surface and a pair of lateral side surfaces. An intersection between the land surface and the front side surface forms a front cutting edge. An intersection between the land surface and each of the pair of lateral side surfaces form a corresponding one of a pair of lateral cutting edges. The edge portion contains 80 vol % or more of diamond. A chip breaker recess is provided between the upper surface and the land surface. The surfaces forming the chip breaker recess include a rake face and a breaker wall surface. The upper surface has a front edge portion opposite to the front cutting edge from the chip breaker recess. A pair of protruding portions are provided to extend from the front edge portion toward the front cutting edge.

In one aspect, cutting tools are provided comprising radiation ablation regions defining at least one of refractory surface microstructures and/or nanostructures. For example, a cutting tool described herein comprises at least one cutting edge formed by intersection of a flank face and a rake face, the flank face formed of a refractory material comprising radiation ablation regions defining at least one of surface microstructures and surface nanostructures, wherein surface pore structure of the refractory material is not occluded by the surface microstructures and surface nanostructures.

A cutting tool according to this invention includes a cutting edge configured to cut a workpiece; a rake surface configured to come in contact with a chip, which appears when the workpiece is cut by the cutting edge; and a relieved surface configured to come in contact with a to-be-cut surface of the workpiece. A plurality of first grooves are formed on a cutting edge side of the rake surface. The plurality of first grooves includes a plurality of aligned grooves arranged adjacent to each other, and a connection groove connecting at least two of the plurality of aligned grooves to each other.

A cutting edge of a machining tool and a surface treatment method for the same. A cutting edge of a machining tool and a region in the vicinity of the cutting edge, e.g. a region of at least 1 mm and preferably at least 5 mm from the cutting edge, are defined as a treatment region; and substantially spherical injection granules having a median diameter of 1 to 20 m are injected onto the treatment region with an injection pressure of 0.01 MPa to 0.7 MPa in order for dimples having an equivalent diameter of 1 to 18 m and preferably 1 to 12 m, and a depth at least equal to 0.02 m and at most equal to 1.0 m to be formed such that the projected surface area of the dimples is at least equal to 30% of the surface area of the treatment region.

The invention relates to a carrier tool (1) comprising a clamping element (2) with a clamping element projection (3) and comprising a cutting insert (4) with a clamping recess (5) on the cutting insert surface (13) for machining workpieces. The clamping recess (5) has an annular indentation (9) with a recess base (7), and the indentation (9) transitions from the recess base (7) into the cutting insert surface (13) via an annular surface (8). The indentation (9) surrounds an elevation (10), the tip (11) of which lies above the recess base (7) and below the cutting insert surface (13). The clamping element projection (3) engages into the clamping recess (5) and thus clamps same on the carrier tool (1). In order to allow a pre-centering of the contour of the clamping element projection (3) and the contour of the clamping recess (5) when closing the clamping element (2), the contours of the clamping element projection and the clamping recess thus engaging into each other in a form-fitting and precisely positioned manner, the clamping element projection (3) has an annular contour (12) which surrounds the elevation (10) in the clamped state but does not contact the elevation and rests solely on the annular surface (8).