B23D61/185

Abrasive sawing wire, production method thereof and use of same

An abrasive wire including a steel core and a coating including a binder and abrasive particles, the binder being formed by at least one iron alloy layer containing, by weight percent in relation to the weight of the binder: between 0 and 3% oxygen, advantageously between 0 and 2%; and between 0.3% and 9% of at least one element selected from the group including carbon, boron an phosphorous.

CUTTING BELT
20180215073 · 2018-08-02 · ·

The present disclosure pertains generally to cutting belts, in particular cutting belts having a cable. In certain aspects, this disclosure provides new cutting segments and cable arrangements for cutting belts. In some embodiments, the cutting belt has cable arrangements that resist rotation when under tension. Cutting belts having cable segments positioned radially outward of other cable segments, relative to the central opening of the cutting belt, around at least 60% of the length of the cutting belt, and cutting belts having cable segments with different twist directions are disclosed.

ABRASIVE WIRE FOR CUTTING SLICES FROM AN INGOT OF HARD MATERIAL

The invention relates to an abrasive wire which comprises: abrasive particles (32) of which the 5% minimum diameter, denoted D5, is no lower than 5 m and of which the 95% maximum diameter, denoted D95, is less than 40 m; and a binder (34) which mechanically holds the abrasive particles on a central core, the thickness of said binder being between Tbo_min and Tbo_max, where Tbo_min and Tbo_max are provided by the following relationships Tbo_max=D5(1Emin/100) and Tho_min=D95(1Emax/100), where Emin and Emax are, respectively, greater than 50% and less than 90%. The binder (34) has a hardness of greater than 450 Hv on the Vickers scale and the number of abrasive particles (32) per millimeter of wire is less than 31 and greater than 1 over at least 1 km of the length of the wire.

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
10011046 · 2018-07-03 · ·

The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm.sup.2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece.

PROCESS FOR MANUFACTURING A CLOSED LOOP OF CUTTING WIRE
20180169778 · 2018-06-21 ·

This process for manufacturing a closed loop of cutting wire comprises manufacturing a cutting wire comprising a central core extending continuously between two free ends. The central core having a tensile strength higher than 1400 MPa. The process includes welding the two free ends together to form the closed loop of cutting wire, in which: the manufacture of the cutting wire comprises making the central core from a material that is solid-state weldable. The welding is a solid-state welding operation comprising crushing, at a temperature below the melting point of the material of the central core, one of the free ends against the other of its free ends until the two ends have interpenetrated and formed a single uniform body of material.

ABRASIVE ARTICLE AND METHOD OF FORMING

An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450? C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

METHOD AND APPARATUS FOR REMOVING UNDERWATER PLATFORMS
20180154468 · 2018-06-07 ·

A method is provided for removing an abandoned marine platform from a seabed. The platform extends below the seabed mud line. In order to remove the platform, a frame is provided having a perimeter that surrounds an open center. The frame is lowered over the platform wherein the platform occupies the open center portion. A movable cutter cable is fitted to the frame. At least a part of the cutter cable is positioned below the mud line. The cutter is moved relative to the frame to cut the platform below the mud line. Such movement can be a back and forth movement wherein the cutter cable moves in a first direction, stops and then moves in a second direction that is generally opposite the first direction. A lifting device can employ two vessels and two frames, each frame bridging from one vessel to the other. Winches on the vessel can be used to provide movement to the cutter cable. These same winches can take up cable slack as cutting moves from one platform member (e.g. leg, jacket leg, piling, etc) to another.

Wire saw apparatus and cut-machining method

A wire saw apparatus 1 executes cut-machining by pressing a workpiece W against a cutting wire 3 spirally wound around multiple wire guides 2, while running the cutting wire 3 and simultaneously swinging the wire guides 2 as well as the cutting wire 3. The wire saw apparatus 1 includes a controller 8 controlling a position of a workpiece holder 51 for holding the workpiece W. The position is controlled depending on a swing angle of the cutting wire 3 so that machined portion of the workpiece W is shaped into an arc.

METHODS FOR PRODUCING DIAMOND GRITS FOR A WAFER SLICING SYSTEM

A method for producing diamond grits for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated. The intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.

Cutting Bead for a Saw Rope
20180099433 · 2018-04-12 ·

A cutting bead (13) for a saw rope (15) comprises a geometrically defined cutting portion (2) and tapers from the geometrically defined cutting portion (2) contrary to a sawing direction. With such cutting beads (13), a saw rope (15) is formed. In a method for manufacturing a saw rope (15), a cutting element (1) with a geometrically defined cutting portion (2) and an abrasive element (6) with a geometrically undefined cutting portion (14) or a neutral element (8) are joined. With the cutting element (1) and the abrasive element (6) or the neutral element (8), a cutting bead (13) is formed. The cutting bead (13) is joined onto the support rope (16).