Patent classifications
B23H1/028
Wire electric discharge machining device, and control method and control program therefor
The object of the present invention is to make it possible to maintain a stable electric discharge and to achieve a stable quality and machining performance even when a work having a non-uniform composition is machined. A wire electric discharge machining device performs electric discharge machining on a work while controlling an inter-electrode distance between a wire and the work based on an inter-electrode voltage between the wire and the work so as to match a set target voltage. The wire electric discharge machining device includes an inter-electrode voltage measuring unit that measures the inter-electrode voltage, an actual amplitude calculating unit that calculates an amplitude of the measured inter-electrode voltage, and a target voltage correcting unit that corrects the target voltage in such a way that the calculated amplitude approaches the target amplitude that is set to a value larger than zero.
Electrical discharge machining system having independent electrodes, related control system and method
An electrical discharge machining (EDM) system, control system and related methods. Various embodiments include a control system for controlling a plurality of electrode devices in an EDM system to form holes in a workpiece. The control system can be configured to perform a process including: initiating a hole formation program for each of the plurality of electrode devices; determining whether at least one electrode has completed formation of a corresponding hole in the workpiece; and separating at least one electrode from the workpiece in response to determining that at least one electrode has completed formation of the corresponding hole.
Wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer
A controller controls cutting of simultaneously cutting wafers by performing electrical discharge machining while moving a workpiece relative to cutting wire sections in a direction at right angles to the cutting wire sections in a plane perpendicular to the axial direction of main guide rollers and leaving a connection at which a part of each wafer that has been incompletely cut is still connected to the workpiece, and shape correction of causing the cutting wire sections to perform scanning while performing electrical discharge machining along a path of the cutting wire sections in a cutting direction at the time of the cutting to simultaneously correct the shape of a plurality of cut surfaces that are cut at the time of the cutting.
TOOL ELECTRODE FOR AND METHODS OF ELECTRICAL DISCHARGE MACHINING
Tool electrodes for and methods of electrical discharge machining are provided. In one exemplary aspect, a tool electrode for machining features into a workpiece is provided that allows for increased machining speed without sacrificing the quality of the machined features. Moreover, a tool electrode is provided that eliminates or reduces the high cost associated with customized tool electrodes. In particular, a tool electrode is provided that includes a plurality of electrode elements arranged and spaced apart in a digitized matrix representative of a tooling shape for machining features into a workpiece. The plurality of electrode elements are spaced apart from one another and arranged in the digitized matrix by digitizing an analog electrode tool configured to machine the feature into the workpiece or a volume of the feature to be machined into the workpiece.
Electrical discharge machining apparatus
An EDM machine includes a machine head, a wire guide, a machining wire extending from the wire guide to the machine head, a rotary table mounted to a first surface and a fixed table mounted to the rotary table, and a fixture mounted to the fixed table. The fixture includes a mounting portion substantially circumscribing the fixture. The mounting portion further includes a mounting surface. The mounting surface is closer to a first surface than an upper surface of the fixed table.
Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus
To perform highly accurate cutting according to stable power feed from a machining power supply, a wire electric discharge machining apparatus includes a wire wound over main guide rollers a plurality of times to simultaneously perform a plurality of kinds of cutting. Wire laying work for a plurality of the wires on power feed elements is reduced, uniform power is fed to cutting wire sections, stable machining is intended, and according to alignment positions, for each of units, a plurality of the power feed elements are aligned to correspond to a wire parallel arrangement interval of the cutting wire sections set as power feed targets and are disposed to feed power to the cutting wire sections with an interval of at least every other cutting wire section.
Power supply unit and multi-wire electrical discharge machining apparatus
Provided is a power supply unit, which is to be used for a multi-wire electrical discharge machining apparatus arranged to slice a material to be machined by an electrical discharge generated between a wire group including a plurality of turns of a wire arranged in parallel and the material to be machined, and to which a power supply terminal to be brought into contact with the wire group at a time to supply a voltage to the wire group is mounted, the power supply unit including: a mounting portion to which the power supply terminal to be brought into contact with the wire group at a time is mounted; and an adjusting portion arranged to adjust an inclination of the mounting portion in a direction crossing a running direction of the wire group.
MULTIWIRE ELECTRIC DISCHARGE MACHINE, MULTIWIRE ELECTRIC DISCHARGE MACHINING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
A multiwire electric discharge machine includes: a plurality of guide rollers; a machining power supply that applies a voltage between each of a plurality of cutting wire sections and a workpiece; a dummy workpiece including a contact surface curved in such a way as to be capable of coming into contact with a curved surface of the workpiece except for an end point, the end point being to be reached by each of the plurality of cutting wire sections when machining of the workpiece is completed, the dummy workpiece supporting the workpiece from one side in a first direction, the first direction being a direction in which the workpiece moves; and a pressing mechanism including a pressing portion, the pressing mechanism pressing the workpiece against the dummy workpiece by bringing the pressing portion into contact with the workpiece from another side in the first direction.
NON-CONTACT WIRE ARRAY TENSION CONTROL DEVICE
The present invention provides a non-contact wire array tension control device for controlling a plurality of tension respectively corresponding to a plurality of electrical discharge wires, including delivering spools and electromagnets. The delivering spool has a magnetic end and a wire outputting end, the wire outputting end is coupled with an electrical discharge wire for outputting the electrical discharge wire. A plurality of electromagnets are coupled to the corresponding magnetic end for controlling a spin rate of the corresponding delivering spool, wherein the spin rate of the corresponding delivering spool is controlled by adjusting a magnetic force generated by the electromagnet. Moreover, a magnetic direction of the electromagnet is parallel to an axial direction of the delivering spool. The invention uses the electromagnets to control the magnetic damping force of the delivering spools for simultaneously controlling the tension of the electrical discharge wires by non-contact method.
SYSTEM AND METHODS FOR ELECTRIC DISCHARGE MACHINING
A multi-loop controller component for an electric discharge machining (EDM) system includes a plurality of power loop circuits coupled to an output of a power supply of the EDM system and configured to receive DC electric power from the power supply. Each power loop circuitis electrically-isolated from other power loop circuits. The multi-loop controller component also includes a plurality of transistors. Each transistor is coupled to a respective power loop circuit and is configured to switch between an ON state and an OFF state to generate a pulse of the DC electric power through the respective power loop circuit. In addition, the multi-loop controller component has a drive controller coupled to the plurality of transistors. The drive controller is configured to transmit at least one control signal to at least one of the transistors to facilitate switching the transistor between the ON state and the OFF state.