A machine for machining a workpiece having a central longitudinal axis is provided. The machine includes a chuck or fixture on which the workpiece is disposable, a grinding spindle to remove material from the workpiece, the grinding spindle having a central longitudinal axis about which the grinding spindle rotates and being disposed with the central longitudinal axes intersecting one another so as to create a continuous gear tooth on the workpiece and an electrochemical grinding (ECG) element configured to execute ECG processing on the grinding spindle and the workpiece to soften the workpiece as the gear tooth is being created by the grinding spindle.

A machine for machining a workpiece having a central longitudinal axis is provided. The machine includes a chuck or fixture on which the workpiece is disposable, a grinding spindle to remove material from the workpiece, the grinding spindle having a central longitudinal axis about which the grinding spindle rotates and being disposed with the central longitudinal axes intersecting one another so as to create a continuous gear tooth on the workpiece and an electrochemical grinding (ECG) element configured to execute ECG processing on the grinding spindle and the workpiece to soften the workpiece as the gear tooth is being created by the grinding spindle.

A slurry for electrochemical mechanical polishing of semiconductor workpieces (e.g., silicon carbide semiconductor wafers) is provided. In one example embodiment, the slurry contains a solvent an abrasive particle, and an ionic compound. The ionic compound contains a cation and an anion. One or more of the cation or the anion is bonded to the abrasive particle, for instance, with a functional group or other bonding.

An example polishing system, such as an electrochemical mechanical polishing (ECMP) system, includes a polishing pad assembly having a polishing pad. The example polishing system includes a bias source. The example polishing system includes a workpiece carrier operable to bring the semiconductor workpiece into contact with the polishing pad. In some implementations, the polishing pad assembly is operable to provide an electrically conductive path for one or more charge carriers to the bias source.