A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

The present disclosure relates to an electrical discharge machining (EDM) device, and a method for machining a workpiece by the EDM device. The EDM device includes a spindle, a guide structure including a plurality of guideways, and a plurality of electrodes, the electrode coupled to the spindle via a flexible link, and slidably engaged with a respective one of the plurality of guideways.

The present disclosure relates to an electrical discharge machining (EDM) device, and a method for machining a workpiece by the EDM device. The EDM device includes a spindle, a guide structure including a plurality of guideways, and a plurality of electrodes, the electrode coupled to the spindle via a flexible link, and slidably engaged with a respective one of the plurality of guideways.

A method for the removal of debris (75) from an aperture (60), the aperture comprising a first aperture diameter (64) and extending along a first axis (62) over a first distance (63), the method comprising the steps of aligning a beam of energy (80) with the first axis such that the beam of energy is coaxially aligned with the aperture, the beam of energy comprising both an energy sufficient to remove the debris, and a first beam diameter (82) which is less than the first aperture diameter; and, exposing the debris to the beam of energy in order to remove the debris from the aperture.

An electrochemical machining assembly for boring a passage in an electrically conductive workpiece. The electrochemical machining assembly includes an electrochemical machining tool having a telescoping collar with an articulating head coupled thereto. The telescoping collar is actuated between a contracted configuration and an extended configuration to advance the telescoping collar stepwise in the passage. The articulating head is tiltable relative to the telescoping collar to determine a direction of the passage. The electrochemical machining assembly is configured to remove material from the workpiece upon application of a voltage between the articulating head and the workpiece via a circulating electrolyte fluid to lengthen the passage.

An electrochemical machining apparatus being capable of performing multiple points and multiple angles machining is provided. The electrochemical machining apparatus includes at least one electrode member, a guiding member and an actuation member. The electrode member includes a conductive end and a free end, wherein the electrode member is rigid and unbendable. The guiding member is for limiting and guiding the electrode member to move. The actuation member is for exerting a force to the free end of the electrode member, thereby enabling the conductive end of the electrode member to form angle variations. A force-exerting direction from the actuation member to the free end is parallel to a central axis of the electrode member or deflects off the central axis so as to form the angle variations.

An electrochemical machining device includes a plurality of electrodes, a guiding member and a plate member. The electrodes are disposed around a workpiece. The guiding member is configured to limit and guide each of the electrodes to move. The plate member is configured to exert a force to each of the electrodes. The driving member is configured to rotate the workpiece. The plate member is connected to each of the electrodes. A force-exerting direction of the force from the plate member to each of the electrodes is parallel to a central axis of each of the electrodes or deflects off the central axis. Each of the electrodes is passed through the guiding member and configured to perform a machining on the workpiece which is rotated by the driving member, and each of the electrodes has an electrochemical machining direction which is perpendicular, oblique or parallel to the workpiece.

An electrical discharge machining (EDM) system, control system and related methods. Various embodiments include a control system for controlling a plurality of electrode devices in an EDM system to form holes in a workpiece. The control system can be configured to perform a process including: initiating a hole formation program for each of the plurality of electrode devices; determining whether at least one electrode has completed formation of a corresponding hole in the workpiece; and separating at least one electrode from the workpiece in response to determining that at least one electrode has completed formation of the corresponding hole.

An electrical discharge machining (EDM) system, control system and related methods. Various embodiments include a control system for controlling a plurality of electrode devices in an EDM system to form holes in a workpiece. The control system can be configured to perform a process including: initiating a hole formation program for each of the plurality of electrode devices; determining whether at least one electrode has completed formation of a corresponding hole in the workpiece; and separating at least one electrode from the workpiece in response to determining that at least one electrode has completed formation of the corresponding hole.