A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

An LED tube lamp comprises a glass lamp tube having a main body, two end caps coupled to a respective end of the tube, an LED light strip adhered to inner circumferential surface of the tube by first adhesive, a plurality of LED light sources mounted on a mounting region, a power supply module having a circuit board and a plurality of electronic components mounted on the circuit board, a diffusion layer covering on outer surface or inner surface of the tube, and a protective layer being disposed on surface of the strip and having a plurality of first openings for disposing the plurality of LED light sources. The strip comprises the mounting region and connecting region at an end of the strip. The circuit board is substantially parallel with axial direction of the tube, electrically connects to the connecting region, and stacks with a portion of the connecting region.

Discussed is a battery module assembly apparatus using vision, the battery module assembly apparatus including: a transfer unit configured to move in at least one of forwards, rearwards, leftwards and rightwards when a battery module having a battery cell received therein is seated on the transfer unit; a vision unit configured to check a position of the battery module; and a bonding unit configured to electrically connect an electrode of the battery cell and a busbar to each other.

A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

The present disclosure relates to a brazing structure. The brazing structure may comprise a first portion and a second portion. At least one of the first portion or the second portion may include a connection-reinforcing surface. The connection-reinforcing surface may include a groove region and a filler placement region. The filler placement region may be configured to hold a filler material in solid state before brazing. The groove region may include a plurality of grooves where the filler material flows into after being melted. The first portion and the second portion may be connected by a braze joint formed by the filler material.

A connector that includes contact assemblies and non-conductive stack spacers separating the contact assemblies from each other, the contact assemblies and the stack spacers defining a connector lumen configured to receive a portion of an electrical stimulation lead. The contact assemblies and stack spacers are brazed together forming a sealed connector stack that resists passage of fluid between the contact assemblies and stack spacers. Alternatively or additionally, the stack spacers are made of a non-conductive ceramic, crystalline, or glass material.

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

A bonding apparatus provided with a gas supplying unit for causing an inert gas to be sprayed from a spray aperture provided adjacent to a holding section of the bonding head. The spray aperture is provided so as to surround the holding section of the bonding head, in which a portion of the slits is a wide slit set to a higher jet flow rate of the inert gas than narrow slits of another portion, and the inert gas sprayed from the wide slit and the narrow slits forms an air curtain that surrounds the bonding portion between the semiconductor chip and the substrate. The inert gas sprayed from the wide slit forms a flow that passes between the semiconductor chip and the substrate.