An electronic device includes a plurality of micro-optoelectronic components and a circuit board. Each of micro-optoelectronic components includes a semiconductor layer, and metal electrodes electrically coupled to the semiconductor layer and exposed on a surface of the semiconductor layer. The circuit board includes a metal circuit layer and a plurality of solder joints. The solder joints are formed on said metal circuit layer, and connected to said metal electrodes. A portion of each of metal electrodes and each of solder joints are welded to form a metal crystalline structure. The metal crystalline structure includes the composition of the metal electrode and/or the composition of the metal circuit layer.

A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.

A method for selectively adhering braze powders to a surface comprises applying a binder material to a surface, depositing a braze powder on the binder material, and then directing a laser beam onto the braze powder while the laser beam moves along a predetermined path relative to the surface. The laser beam selectively heats the braze powder and the binder material along the predetermined path such that the binder material is removed and the braze powder is sintered and bonded to the surface. Thus, a braze deposit is formed at one or more predetermined locations on the surface. After forming the braze deposit, excess braze powder and binder material, that is, the braze powder and binder material not selectively heated by the laser, are removed from the surface.

In various examples, an apparatus includes a first hypotube formed from a first material and a second hypotube formed from a second material different from the first material. A first joint is formed between the first hypotube and the second hypotube, the first joint including a combination of the first material and the second material. The apparatus includes a sidewall and a passageway extending through the apparatus. The sidewall is formed by the first sidewall of the first hypotube, the second sidewall of the second hypotube, and the first joint. The apparatus includes an outer diameter that is substantially consistent along a length of the apparatus and an inner diameter that is substantially consistent along a length of the apparatus. In other examples, a method of joining the first hypotube to the second hypotube is contemplated.

Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.

A screen tensioning apparatus for a mask is provided. The screen tensioning apparatus includes a supporting device, a first movable mechanism and an ultrasonic soldering device. The supporting device is disposed to support a mask framework. The ultrasonic soldering device includes an ultrasonic soldering head. The ultrasonic soldering head is fixedly connected to the first movable mechanism. The mask framework is disposed on the supporting device. The ultrasonic soldering head is disposed on one side of the mask framework facing away from the supporting device.

An article of manufacture comprises a first component having a first mating surface and a second component having a second mating surface. The first component may include an aperture having internal splines or gear teeth, and/or an outer perimeter having external splines or gear teeth. The first and second components are disposed such that a gap is provided between the first and second mating surfaces. Brazing material is disposed between the first and second mating surfaces so as to mechanically couple the first and second components. The first component may be made of a powdered metal or a non-powdered metal, and the second component may be made of the other of such two metals. In one embodiment, the first component may be a planetary carrier plate portion having internal splines and the second component may be a planetary carrier spider portion.

A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.

In various embodiments, a workpiece is processed utilizing one or more output beams emitted from a step-core optical fiber and formed from one or more input beams that may have non-circular beam shapes. In various embodiments, an input beam may be a variable-power laser beam having a laser-beam numerical aperture (NA) that varies as a function of the power of the laser beam. The step-core optical fiber may have an outer core NA that is greater than or equal to the laser-beam NA at a laser power of approximately 100%, an inner core NA that is less than or equal to the outer core NA, and an inner core NA that is greater than or equal to the laser-beam NA at a power of 50%.

Methods of reflowing electrically conductive elements on a wafer may involve directing a laser beam toward a region of a surface of a wafer supported on a film of a film frame to reflow at least one electrically conductive element on the surface of the wafer. In some embodiments, the wafer may be detached from a carrier substrate and be secured to the film frame before laser reflow. Apparatus for performing the methods, and methods of repairing previously reflowed conductive elements on a wafer are also disclosed.