A fiber array unit (FAU) includes a substrate, a plurality of optical fibers, and a lid. The substrate includes: an optical window extending through a layer of non-transparent material, a plurality of grooves, and an alignment protrusion configured to mate with an alignment receiver. The plurality of optical fibers are disposed in the plurality of grooves. The alignment protrusion is configured to align the plurality of optical fibers with an external device when mated with the alignment receiver. The plurality of optical fibers is disposed between the lid and the substrate.

A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

A jig apparatus is used for assembling a trunk lid including an upper panel, an extension panel, and a lower panel. The jig apparatus may include: a jig frame; a first activation jig unit configured to align and fix the upper panel and the extension panel and installed at the jig frame in front and rear directions to be tilting-rotatable; and a second activation jig unit aligning and fixing the lower panel and installed at the jig frame to be linearly movable in the front and rear directions with respect to the first activation jig unit.

A method for producing a component by brazing and a related component are disclosed. The component may include a first part, a second part and a third part, wherein the first part includes a first junction part, the second part includes a second junction part and a cross junction part, and the third part includes a third junction part, and wherein the third junction part has a part and a remaining part. In an embodiment the method includes coupling the first part and the second part to each other by performing a preceding weld in a state of overlapping a part of the first junction part and the second junction part and, after performing the preceding weld, coupling the first part, the second part, and the third part to each other by performing a following weld.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

The control device includes a brazing controller configured to control a brazing material moving mechanism so as to retract a tip of a brazing material from a heating position to interrupt the brazing, during execution of the brazing, and a movement controller configured to, when the brazing is interrupted, control a movement machine so as to retract a heating device or a base material in a direction opposite to a movement direction during the execution of the brazing, and subsequently advance the heating device or the base material in the movement direction again. The brazing controller resumes the brazing by controlling the brazing material moving mechanism so as to cause the tip of the brazing material to reach the heating position at the same time when the heating device or the base material advanced by the movement controller reaches an interruption position at which the brazing is interrupted.

A method for soldering electronic components includes providing a circuit substrate; providing a plurality of electronic components; placing the plurality of electronic components onto the circuit substrate; applying a conductor between the plurality of electronic components and the circuit substrate; providing an energy source which projects an energy beam with a first coverage; enlarging the energy beam and projecting the energy beam onto the circuit substrate with a second coverage; and melting the conductor within the second coverage via the energy beam and fixing the corresponding electronic components on the circuit substrate through the melted conductor. Besides, a method for manufacturing a LED display is disclosed.

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

The present invention provides a laser soldering device including a transfer unit configured to transfer a plurality of objects, a solder unit configured to operate under control of the controller to solder the object positioned on the transfer unit, and form a bonding surface by performing the soldering by a laser beam, and at least one nozzle unit in which a solder ball to which the laser beam is irradiated is accommodated, in which the laser beam irradiated from the solder unit is eccentric with respect to a center line of the solder ball and adjusted to be irradiated.

A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted.