An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.

Presented are intelligent non-autogenous metalworking systems and control logic for automated wire-to-beam alignment, methods for making/using such systems, and robot-borne laser welding/brazing heads with closed-loop control for real-time wire alignment. A method for controlling operation of a non-autogenous workpiece processing system includes a system controller receiving sensor signals from a position sensor indicative of a location of filler wire discharged into a joint region by a wire feeder. Using the received sensor signals, the controller determines a displacement between the wire location and a location of a beam emitted onto the joint region by a beam emitter. If the wire displacement is greater than a threshold wire displacement value, the controller responsively determines a corrective force calculated to reduce wire displacement to below the threshold wire displacement value. The controller then commands the actuator to pivot the processing head to thereby apply the corrective force to the discharging filler wire.

A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.

A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.

A laser-assisted soldering apparatus includes a solder jetting section and a laser coupling unit. The solder jetting section includes a jetting nozzle and a solder body holding capillary adapted to hold a solder body that is being liquefied by a laser beam. The laser coupling unit includes an optical window, a laser entry, a laser passage, a fastening section, and a laser exit. The laser passage extends from the laser entry to the laser exit and is aligned with the solder body holding capillary. The optical window is transparent to the laser beam. The fastening section is fastened to the solder jetting section. A first pressure gas feeding passage merges into the laser passage between the optical window and the fastening section. The solder jetting section includes a second pressure gas feeding passage that merges into the solder body holding capillary between the laser exit and the jetting nozzle.

A hot wind is blown to a land and a lead from the underside of a printed board, to perform preheating. At the start of preheating or after start of preheating, a laser beam is applied to a soldering point, and meanwhile, wire solder is fed to a position contacting with the soldering point. The fed wire solder is melted by the laser beam. After soldering is finished, feeding of the wire solder is stopped. Application of the laser beam is stopped, to solidify the melted solder.

A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a braze region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the braze region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the solidus temperature of the braze material. A braze precursor material is also provided.

A method for bonding semiconductor substrates includes placing a die on a substrate and performing a heating process on the die and the substrate to bond the respective first connectors with the respective second connectors. Respective first connectors of a plurality of first connectors on the die contact respective second connectors of a plurality of second connectors on the substrate. The heating process includes placing a mask between a laser generator and the substrate and performing a laser shot. The mask includes a masking layer and a transparent layer. Portions of the masking layer are opaque. The laser passes through a first gap in the masking layer and through the transparent layer to heat a first portion of a top side of the die opposite the substrate.

A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.

A method for analyzing a laser machining process for machining workpieces includes the steps of acquiring at least one sensor data set for the laser machining process and determining a value of at least one physical property of a machining result of the laser machining process based on the at least one sensor data set using a transfer function. The transfer function is formed by a trained neural network. A system for analyzing a laser machining process and a laser machining system including such a system are also disclosed.