A 3D printer that is mostly twenty to thirty times faster than existing 3D printers. Pixel-based Raster images are converted into Scalable Vector Graphic (SVG) images, which are then categorized as lines, curves and surface areas. For each category, faster printing methods for printing with pre-formed shapes such as rods, boards, arcs, etc., are disclosed. Pre-formed shapes may be made of plastic/thermoplastic/polymer or sintering materials, as desired. Sintering materials may be cladded/coated with appropriate materials such as solder, copper, and thermoplastics. The new print-head, which has a fixed portion and a replaceable portion, has a mechanism to draw upon pre-formed shapes to print. The replaceable portion has varying shapes and sizes of placement holes, and a mechanism to signal which replaceable portion has been mounted. The print-head incorporates mechanisms to heat and tack the pre-formed shapes. The invention discloses methods to use multiple print-heads to further speed up printing.

An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

Provided is a method for determining a laser irradiation state whereby the output of a laser can be acquired with high accuracy. This method for determining a laser irradiation state determines the irradiation state of a laser irradiated by a laser irradiation device and includes: an output stabilization time acquisition step for acquiring, as an output stabilization time, the time from the start of laser irradiation by the laser irradiation device until the stabilization of the output of the laser; an energy acquisition step for acquiring, after the output stabilization time or longer has elapsed from the start of the laser irradiation by the laser irradiation device, the energy of the laser irradiated by the laser irradiation device in a pre-set prescribed period; a conversion step for converting the acquired energy to the output of the laser irradiated by the laser irradiation device; and a state determination step for determining the irradiation state of the laser on the basis of the converted output of the laser.

A semiconductor device includes an insulating substrate formed by integrating a ceramic base plate and a cooling fin; a multiple of plate interconnection members; and a plurality of semiconductor elements. The one faces of the semiconductor elements are bonded to the ceramic base plate of the insulating substrate with a chip-bottom solder, and the other faces thereof are bonded to the plate-interconnection members with a chip-top solder so that plate interconnection members correspond respectively to the semiconductor elements. The chip-bottom solder and the chip-top solder both contain mainly Sn and 0.3-3 wt. % Ag and 0.5-1 wt. % Cu. This allows the semiconductor device to be reduced in size without impairing heat dissipation.

The invention relates to a laser brazing system, comprising a braze tool having a laser configured to emit a laser beam along a radiation path, and a braze wire tool being configured to guide a braze wire along a wire path intersecting the laser beam. The system comprises a jig comprising a first alignment surface and a first blocking surface, wherein the first alignment surface is configured to be in contact with the braze wire while the first blocking surface blocks at least a first part of the emitted laser beam, and a detector arranged in the radiation path and configured to detect the emitted light of the laser beam passing the jig.

In one example, a system can comprise a laser assisted bonding (LAB) tool comprising a stage block and a laser source facing the stage block. The stage block can be configured to support a first substrate and a first electronic component coupled with the first substrate, the first electronic component comprising a first interconnect. The laser source can be configured to emit a first laser towards the stage block to induce a first heat on the first interconnect to bond the first interconnect with the first substrate. Other examples and related methods are also disclosed herein.

A soldering device includes a laser head for outputting a laser beam and a solder feeder for feeding a thread solder to a path of the laser beam. The soldering device includes a solder receiving member for receiving solder melted by the laser beam and a pouring member for pouring molten solder into a workpiece. The solder receiving member includes a recess part having a shape for retaining the molten solder. The pouring member has a groove part communicating with the recess part and allowing the solder to flow therein.

Assembly for placing solder from solder balls on a substrate, comprising a reservoir with a plurality of solder balls, an exit opening for releasing one single solder ball, a feeding channel between the reservoir and the exit opening with a feeding channel width larger than the diameter of one solder ball and smaller than the diameter of two solder balls, and a suction channel with end opening into the feeding channel which end is smaller than the diameter of one solder ball. A pressure difference is generated between the feeding channel and the suction channel and is controlled whereby pressure in the suction channel is smaller than in the feeding channel. A solder ball present in the feeding channel can be sucked to and held to the end of the suction channel at a first pressure difference to block feeding of solder balls and is released at a second pressure difference.

Disclosed are laser bonding apparatuses and methods, The laser bonding apparatus comprises a stage configured to receive a substrate, a laser device that may be disposed on the stage and is configured to irradiate a laser beam onto the substrate, a first rotation support disposed outside of the stage and is configured to drivee the laser device to rotate in an azimuthal angle direction, and a second rotation support configured to support the laser device and configured to drive the laser device to rotate in a polar angle direction intersecting the azimuthal angle direction.

A method for laser soldering includes selecting a copper-containing material as a filler material, supplying the filler material at a butt joint of two components, and melting the filler material in a main process zone by means of laser radiation in an advancement direction. The filler material in the main process zone is melted by means of laser radiation of a wavelength λH in the blue or green spectral range with 400 nm≤λH≤600 nm.