A composition includes a hydrofluoroepoxide having Structural Formula (I). Each R.sub.f is, independently, a linear or branched perfluoroalkyl group having 1-6 carbon atoms and optionally comprises a catenated heteroatom.

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A composition includes a hydrofluoroepoxide having Structural Formula (I). Each R.sub.f is, independently, a linear or branched perfluoroalkyl group having 1-6 carbon atoms and optionally comprises a catenated heteroatom.

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A vapor-phase type heating method includes: collecting, in the vapor tank, the heat transfer liquid which has come into contact with a heating target object, has cooled to liquefy, and has fallen down as droplets from a front surface of the heating target object to a lower portion of a heating furnace; resupplying, to the heating furnace, heated gas to which the vapor has been supplied and which has been formed by supplying the vapor from the vapor tank to heated gas obtained from heating the heating target object discharged from the heating furnace to a circulation pathway; and heating the heating target object, at a predetermined rate of temperature rise in a state of an even distribution of the vapor of the heat transfer liquid by maintaining the vapor of the heat transfer liquid in a predetermined amount in the heating furnace by the collection and the supply.

A vapor-phase type heating method includes: collecting, in the vapor tank, the heat transfer liquid which has come into contact with a heating target object, has cooled to liquefy, and has fallen down as droplets from a front surface of the heating target object to a lower portion of a heating furnace; resupplying, to the heating furnace, heated gas to which the vapor has been supplied and which has been formed by supplying the vapor from the vapor tank to heated gas obtained from heating the heating target object discharged from the heating furnace to a circulation pathway; and heating the heating target object, at a predetermined rate of temperature rise in a state of an even distribution of the vapor of the heat transfer liquid by maintaining the vapor of the heat transfer liquid in a predetermined amount in the heating furnace by the collection and the supply.

A gas phase type heating method includes loading an object into a vapor heating furnace or a heating furnace via a loading/unloading portion, cooling vapor of a heat transfer liquid by a cooler provided above the loading/unloading portion in the vapor heating furnace, and causing a gas to go in and out, making a pressure in a continuous furnace uniform, and heating the loaded object, by a connection portion that is provided above the cooler and has a pressure loss smaller than a pressure loss of the loading/unloading portion.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.

An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.