A printed wiring board to which an electronic component is soldered by a jet soldering device, the printed wiring board includes as insulating substrate, a land provided on one surface of the insulating substrate, the one surface serving as a soldering surface, a through hole provided in the land and passing through the insulating substrate in a thickness direction of the insulating substrate. A lead of the electronic component is inserted into the through hole from the other surface of the insulating substrate, the other surface is opposed to the one surface, and an auxiliary conductor is provided in a region of a plane on the one surface, the region is adjacent to the land in a predetermined direction. The auxiliary conductor is provided to have a width equal to a width of the land in the same region of the plane.

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.

The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.

The disclosure provides a detection device, a detection method, and a recording medium. The detection device includes: an acquisition unit for acquiring the temperature of a solder in a solder bath; a measurement unit for measuring the melting point of the solder from a temporal change in temperature in at least one of a temperature increasing process and a temperature decreasing process; and a detection unit for detecting variation in the copper concentration of the solder on the basis of variation in the melting point.

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame and an exit wing, the exit wing being rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave. A linear actuator is connected via a linkage to the exit wing to allow the linear actuator to adjust an orientation of the exit wing with respect to the nozzle core frame.

The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.

Method for operating a soldering device and soldering device, wherein a graphic representation of at least part of the soldering device is captured, wherein an instantaneous operating state of the soldering device is determined by means of automated processing of the graphic representation dependent on information about the soldering device from the graphic representation, characterized in that the information about the soldering device is determined dependent on a reference representation of at least part of the soldering device, wherein the reference representation is captured as a graphic representation or wherein the reference representation is read as a graphic representation from a memory, and in that the reference representation characterizes a degree of oxidation of solder (122) when the solder (122) flows out over at least part of a surface (124) of a soldering nozzle (116).