A solder bonding method that bonds, using a solder joint, an electrode of a circuit board to an electrode of an electronic component includes: depositing, on the electrode of the circuit board, an SnBi-based solder alloy with a lower melting point than a solder alloy deposited on the electrode of the electronic component; mounting the electronic component on the circuit board such that the SnBi-based solder alloy contacts the solder alloy on the electrode of the electronic component; heating the circuit board to a peak temperature of heating of 150 C. to 180 C.; holding the peak temperature of heating at a holding time of greater than 60 seconds and less than or equal to 150 seconds; and cooling, after the heating and to form the solder joint, the circuit board at a cooling rate greater than or equal to 3 C./sec.

A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

A method for manufacturing metal product having irregular shapes includes steps of providing powder and binding agent, and mixing the powder and binding agent as a mixed feed. The mixed feed is heated to a plastic state, and injected into a mold cavity to form a plurality of blanks. The blanks are degreased to remove the binding agent and are sintered to form workpieces. A substrate or substrates and the workpieces form different parts of the metal product having irregular shapes. The workpieces are disposed on substrate to form a preform and the preform is bonded to form the metal products of irregular shape.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant. The exothermic reaction generates heat to volatilize the solvent carrier.

In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; one or more pins attached to each of the plurality of actuators, one end of each of the plurality of pins affixed to the actuators extrudes beyond surface of the wearable device case and is exposed outside of the wearable device case; electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

A nanoparticle powder is disclosed including a plurality of stabilized nanoparticles having a superalloy composition. At least about 90% of the particles have a convexity between about 0.980-1 and a circularity between about 0.850-1. A method for forming a braze paste is disclosed including mixing the plurality of stabilized nanoparticles with at least one organometallic precursor and up to about 5 wt % binder. A method for modifying an article is disclosed including applying the braze paste to a substrate including at least one crack, removing at least about 70% of the binder in the braze paste, and then applying additional braze paste over the first portion. Under vacuum or inert gas atmosphere, essentially all remaining binder is evaporated. The braze paste is brazed to the article at about 40-60% of the superalloy's bulk liquidus temperature, forming a brazed material and thereby sealing the at least one crack.

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1000 C. The method includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes phosphorus and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1000 C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The melting depressant composition and related products are also described.

Provided is an aluminum alloy laminated plate having a sacrificial material cladded to at least one side surface of a core material, wherein the core material contains specified amounts of Mn, Si, Cu, Mg, Fe, and Ti, the balance is Al and inevitable impurities, the number density of dispersed particles having a particle size of 0.01-0.5 m is 10-100/m.sup.3, and [(the total solid solution amount of Mg, Mn, Si, and Cu)/(the total added amount of Mg, Mn, Si, and Cu)] is 0.10 or more.

Provided is a flux for resin-cored solder that is used in resin-cored solder that is supplied into a through hole formed along a central axis of a soldering iron. The flux includes 60% by mass to 99.9% by mass of a rosin ester to a total mass of the flux, 0.1% by mass to 15% by mass of a covalent halogen compound to the total mass of the flux, and more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine to the total mass of the flux.

A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.