The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

A pre-flux coating for the manufacturing of heat exchanger components of aluminum, wherein the coating comprises a combination of fluxes in the form of potassium aluminum fluoride K.sub.1-3AlF.sub.4-6, potassium trifluoro zincate, KZnF.sub.3, lithium aluminum fluoride Li.sub.3AlF.sub.6, a filler material in the form of metallic Si particles, Al—Si particles and/or potassium fluoro silicate K.sub.2SiF.sub.6, an additive in the form of aluminum oxide and at least one other oxide selected from the group consisting of zinc oxide, titanium oxide and cerium oxide forming a post braze ceramic layer, and a solvent and a binder containing at least 10% by weight of a synthetic resin which is based, as its main constituent, on a methacrylate homopolymer or a methacrylate copolymer.

A hollow aluminum structure that will be brazed includes at least one brazing sheet having a filler metal layer clad onto a core layer. The core layer is composed of aluminum or an aluminum alloy containing less than 0.2 mass % Mg. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass % and Bi: 0.01-0.3 mass %, and further contains Li: 0.004-0.08 mass % and/or Be: 0.006-0.12 mass %, the filler metal layer containing less than 0.1 mass % Mg. The hollow aluminum structure is assembled such that the filler metal layer is present at locations that will form both an interior-facing brazed joint and an exterior-facing brazed joint. Then, flux is applied onto the filler metal layer at the location that will form the exterior brazed joint, and the hollow aluminum structure heated in an inert gas atmosphere to form the interior brazed joint and the exterior brazed joint.

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

A substrate support and method of forming a substrate support are described herein. In one example, a substrate support includes an aluminum body having an upper surface configured to support a large area substrate, a heater element, and a filler material. The aluminum body has a groove formed therein. The heater element is disposed in the groove. The filler material is in contact with the heater element and fills the groove. The contact between the filler material and the perimeter of the heater element is the only material interface within the groove, and the filler material has a larger grain size than a grain size of the aluminum body.

An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

An apparatus, material and method for forming a brazing sheet has a composite braze liner layer of low melting point aluminum alloy and 4000 series braze liner. The low melting point layer of the composite braze liner facilitates low temperature brazing and decrease of the diffusion of magnesium from the core into the composite braze liner. The reduction of magnesium diffusion also lowers the formation of associated magnesium oxides at the braze joint interface that are resistant to removal by Nocolok flux, thereby facilitating the formation of good brazing joints through the use of low temperature controlled atmosphere brazing (CAB) and Nocolok flux. The apparatus also enables the production of brazing sheet materials with high strength and good corrosion property.

A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

A brazing material is interposed between an aluminum-based material and an iron-based material plated with Ni. The brazing material has a structure in which an Al—Si—Ni based alloy layer and an Al layer are bonded via a flux layer. A structure for brazing is formed such that the Al—Si—Ni based alloy layer is located on the aluminum-based material side and the Al layer is located on the iron-based material side. The structure is heated in a furnace and is thereafter cooled, thereby obtaining a brazed joint body in which the Ni plating that is a barrier layer remains and an Al—Ni layer is formed.

A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.