The present invention provides a soldering iron with a tip having two separate halves that are electrically isolated from one another. When both halves of the tip are applied to an electrically conductive material, such as the material to be soldered, an electrical circuit between the tip halves and an electrical power source is completed. Therefore, the tip can reach operating temperatures quickly. When the tip is removed from the joint, the electrical circuit is broken and the tip material may quickly cool to a temperature safe for human contact. The tip material permits higher power outputs than other battery operated portable soldering irons and heat and cools faster the conventional soldering tips.

A heating tool having a temperature sensor fixed within a tip of the heating tool with maximum heat conductivity to the temperature sensor.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed includes an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors. A method of using such a device is also presented herein.

A soldering tool, comprising nozzle shaped soldering tip and a hot gas feed channel that runs in the soldering tip, wherein the hot gas feed channel includes openings that provide a hot gas exhaust, and wherein the soldering tip as well as a portion of a soldering environment is heatable by the hot gas, characterized in that the soldering tip includes one or plural contact surfaces that have a surface structure which corresponds to a surface structure of a soldering object so that the soldering object is thermally contactable by the soldering tip with a minimum heat resistance, wherein a hot gas jet that passes through the openings is forced to perform at least one directional reversal or directional deflection by placement of the soldering tip and contacting the soldering object.

The present invention provides a soldering iron with a tip having two separate halves that are electrically isolated from one another. When both halves of the tip are applied to an electrically conductive material, such as the material to be soldered, an electrical circuit between the tip halves and an electrical power source is completed. Therefore, the tip can reach operating temperatures quickly. When the tip is removed from the joint, the electrical circuit is broken and the tip material may quickly cool to a temperature safe for human contact. The tip material permits higher power outputs than other battery operated portable soldering irons and heat and cools faster the conventional soldering tips.

By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.

Embodiments include a paste transfer tool (PTT), a semiconductor package, and a method of forming the semiconductor package with the paste transfer tool. The PTT includes a top surface and a bottom surface. The PTT also includes one or more pins, where each pin has a first end and a second end, and where the first end is disposed on the body and the second end has a nozzle tip. The method of forming the semiconductor package includes dipping the nozzle tip of the PTT in a paste reservoir to form paste dots on the nozzle tip; disposing the paste dots on one or more pads of a substrate with the PTT; and forming one or more bumps from the on paste dots on the one or more pads of the substrate, where the pads of the substrate are positioned on one or more regions of the substrate.