The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.

The present disclosure concerns a device for soldering the interconnections of photovoltaic panels. The device includes: an inductor, which in turn includes a filament, which substantially develops so as to form two parallel branches: a first branch and a second branch, and an insert, which has a longitudinal development, which is at least partly surrounded longitudinally by said filament and is interposed between said two branches.

Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.

A soldering tool may include a tip portion and a tool body. The tool body may include a handle and the tip portion may be operably coupled to the tool body at a flange that separates the handle from the tip portion. The tip portion may include a tip that is heated to melt solder. The flange may include an end face and a light ring disposed at the end face. The light ring may be configured to direct light toward the tip.

A resistance soldering apparatus suited for soldering an electrical terminal to a glass surface and a method of using such an apparatus is described herein. The resistance soldering apparatus includes an electrode having a distal tip and an electrical terminal having a first major surface in which an indentation is defined and a second major surface opposite the first major surface on which a layer of a solder composition is disposed. The indentation is configured to receive the distal tip of the electrode. The distal tip of the electrode is placed within the indentation and an electrical current is passed through the electrode and the electrical terminal, The electrical current is sufficient to heat the electrode and melt the solder composition on the second major surface.

A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500 F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities.

A method of soldering a shape memory alloy (SMA) element to a component includes positioning a tinned end of the SMA element with respect to a surface of the component, and then directly soldering the tinned end to the surface using solder material having a low liquidus temperature of 500 F. or less when an oxide layer is not present on the SMA element. The end may be soldered using lead-based solder material at a higher temperature when an oxide layer is present. The end may be tinned with flux material containing phosphoric acid or tin fluoride prior to soldering the SMA element. The SMA element may be submersed in an acid bath to remove the oxide layer. The solder material may contain tin and silver, antimony, or zinc, or other materials sufficient for achieving the low liquidus temperature. Heat penetrating the SMA element is controlled to protect shape memory abilities.

An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

A soldering iron head includes a bottom surface, a first side surface, a second side surface opposite to the first side surface, and a positioning slot formed on the bottom surface and extending between the first side surface and the second side surface. The positioning slot is adapted to accommodate and position an exposed end conductor of a cable. The cross section of the positioning slot is trapezoidal in shape, absent a lower bottom. An upper bottom facing side of the trapezoidal cross section of the positioning slot gradually increases in width from the first side surface to the second side surface.