A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.

A soldering station includes a first tool port configured to interface with a first soldering tool, a second tool port configured to interface with a second soldering tool, a display configured to display information relating to one or both of the first and second soldering tools, and processing circuitry configured to interface with the display to provide the information relating to one or both of the first and second soldering tools. The first tool port has a first indicator associated therewith and the second tool port has a second indicator associated therewith. The first indicator generates a first color that is also generated at a third indicator associated with the first soldering tool. The second indictor generates a second color that is also generated at a fourth indicator associated with the second soldering tool, the first and second colors being different from each other.

A heater-sensor complex 10 includes a heating wire 12, a lead wire 14 which is made from the same metal of the heating wire 12 and connected to the proximal end of the heating wire 12, the lead wire 14 having a bigger diameter than the heating wire 12, a non-heating wire 16 constituted by a different metal from the metal constituting the heating wire 12, and a sensor head 18 constituted by a metal different from the metal constituting the heating wire 12 or the metal constituting the non-heating wire 16. The sensor head 18 have a lower thermal conductivity than the non-heating wire. To the sensor head 18, the distal end of the heating wire 12 and the distal end of the non-heating wire is connected. The heating wire 12 and the non-heating wire 16 electrically conducts at least through the sensor head 18.

The disclosure includes a heat-staking device comprising a base, an upright arm coupled to the base, and a head vertically movable along the upright arm. In some embodiments, the head includes a main head unit, a quill coupled to the main head unit, an insulating tip holder coupled to the quill and configured to removably retain a thermal-installation tip, and a handle configured to cause vertical motion of the insulating tip holder. The quill may also include a soldering iron configured to heat the thermal-installation tip. In some embodiments, the heat-staking device is configured to swap out thermal-installation tips while the thermal-installation tips are still hot.

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

A soldering iron hand piece that may be used for both a soldering tip and a soldering cartridge, allowing the same hand piece to be used for both a soldering tip and a soldering cartridge.

The invention relates to a stand of a soldering system and to a soldering system. In addition to the stand, the soldering system includes an electric soldering device, in particular a soldering iron, with a handle, a heating element provided on the handle, and a soldering tip assembly which can be releasably secured to the handle and has a holding element. The stand has at least one exchangeable holder which is formed about an insertion axis and is designed to at least partly complement a holding element such that a soldering tip assembly arranged on the handle can be introduced into the exchangeable holder along the insertion axis, and the exchangeable holder has an anti-rotation element which interacts with the holding element such that, when the soldering tip assembly is inserted into the exchangeable holder, the holding element is rotationally fixed in the exchangeable holder when the handle is rotated from the securing position into the removal position.

A hot stapler includes a body, two heat conducting units, an electrical storage unit, a circuit unit, and a switch button. The body includes a head and a handle. The electrical storage unit is disposed in the handle and has a voltage value less than 6 volts. A first wire and a first resistor of the circuit unit are electrically mounted between one of the two heat conducting units and the electrical storage unit. A second wire and a second resistor of the circuit unit are electrically mounted between the other one of the two heat conducting units and the electrical storage unit. The switch button is disposed on the handle and is switchable between a power-on position and a power-off position.

A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to store parametric data. The tip memory device is configured to exchange data with the controller.