The disclosure relates to a manufacturing line for soldered components on a circuit board, comprising a soldering oven including at least two temperature zones having a predetermined temperature profile, a transport apparatus embodied to transport circuit boards through the temperature zones, and a control system, wherein, in at least one of the temperature zones, at least two heating elements are arranged such that a to-be-soldered surface of each circuit board is heated by the heating elements, wherein, in at least one of the temperature zones, at least two air circulators are arranged in the transport direction offset from one another and facing the surface to be soldered, and wherein the control system is configured to control the heating elements and the air circulators such that the to-be-soldered surface of the circuit board is heated according to the predetermined temperature profile.

A method for joining of at least two materials, non-weldable directly to each other with thermal joining processes in a lap joint configuration includes a two step sequence including a first step to apply a thermomechanical or mechanical surface protection layer on the surface of a (stainless) steel substrate and a second step where, a thermal joining process is used to weld the sprayed layer with an applied aluminum sheet without having brittle intermetallic phases in the whole material configuration.

A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.

A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.

A method is disclosed during which a substrate is provided. Braze powder is deposited with the substrate using an additive manufacturing device. The braze powder is sintered together and to the substrate during the depositing of the braze powder to provide the substrate with sintered braze material. The substrate and the sintered braze material are heated to melt the sintered braze material and diffusion bond the sintered braze material to the substrate.

A method is disclosed during which a substrate is provided. Braze powder is deposited with the substrate using an additive manufacturing device. The braze powder is sintered together and to the substrate during the depositing of the braze powder to provide the substrate with sintered braze material. The substrate and the sintered braze material are heated to melt the sintered braze material and diffusion bond the sintered braze material to the substrate.

A process chamber for carrying out thermal processes in the manufacture of an electronic assembly with at least one opening for moving in and/or removing the electronic assembly; a supply of a protective gas; a controllable protection device arranged at the opening to reduce escape of the protective gas from the process chamber; and a control that can control the protection device such that, when the electronic assembly passes through the opening, an opening cross section of the opening is provided, which corresponds to the cross section of the electronic assembly.

A heater-sensor complex 10 includes a heating wire 12, a lead wire 14 which is made from the same metal of the heating wire 12 and connected to the proximal end of the heating wire 12, the lead wire 14 having a bigger diameter than the heating wire 12, a non-heating wire 16 constituted by a different metal from the metal constituting the heating wire 12, and a sensor head 18 constituted by a metal different from the metal constituting the heating wire 12 or the metal constituting the non-heating wire 16. The sensor head 18 have a lower thermal conductivity than the non-heating wire. To the sensor head 18, the distal end of the heating wire 12 and the distal end of the non-heating wire is connected. The heating wire 12 and the non-heating wire 16 electrically conducts at least through the sensor head 18.

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.