Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

A light emitting diode (LED) tube lamp configured to receive an external driving signal includes an LED module for emitting light, the LED module comprising an LED unit comprising an LED; a rectifying circuit for rectifying the external driving signal to produce a rectified signal, the rectifying circuit having a first output terminal and a second output terminal for outputting the rectified signal; a filtering circuit connected to the LED module, and configured to provide a filtered signal for the LED unit; and a protection circuit for providing protection for the LED tube lamp. The protection circuit includes a voltage divider comprising two elements connected in series between the first and second output terminals of the rectifying circuit, for producing a signal at a connection node between the two elements; and a control circuit coupled to the connection node between the two elements, for receiving, and detecting a state of, the signal at the connection node. The control circuit includes or is coupled to a switching circuit coupled to the rectifying circuit, and the switching circuit is configured to be triggered on or off by the detected state, upon the external driving signal being input to the LED tube lamp, to allow discontinuous current to flow through the LED unit.

A light emitting diode (LED) tube lamp configured to receive an external driving signal includes an LED module for emitting light, the LED module comprising an LED unit comprising an LED; a rectifying circuit for rectifying the external driving signal to produce a rectified signal, the rectifying circuit having a first output terminal and a second output terminal for outputting the rectified signal; a filtering circuit connected to the LED module, and configured to provide a filtered signal for the LED unit; and a protection circuit for providing protection for the LED tube lamp. The protection circuit includes a voltage divider comprising two elements connected in series between the first and second output terminals of the rectifying circuit, for producing a signal at a connection node between the two elements; and a control circuit coupled to the connection node between the two elements, for receiving, and detecting a state of, the signal at the connection node. The control circuit includes or is coupled to a switching circuit coupled to the rectifying circuit, and the switching circuit is configured to be triggered on or off by the detected state, upon the external driving signal being input to the LED tube lamp, to allow discontinuous current to flow through the LED unit.

The present invention relates to a bonding apparatus for a power terminal of a heating plate, for bonding the power terminal supplying power to a heating wire of a substrate. The bonding apparatus for a power terminal of a heating plate comprises: a chamber; a stage which is disposed in an inner space of the chamber and on which the substrate is placed; an upper press portion disposed in the inner space of the chamber to face the stage, provided to be vertically movable, and having a terminal fixing portion configured to fix the power terminal; and an elevating driver configured to move the upper press portion up and down, wherein the terminal fixing portion further includes a magnetic holder configured to hold the power terminal by a magnetic force.

This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

A robotic wire termination system for efficiently connecting a plurality of wires to an electrical connector. The robotic wire termination system generally includes a frame, a connector support attached to the frame, a robot manipulator having at least one arm, a heating device attached to the at least one arm and a control unit in communication with the robot manipulator to control the operation of the robot manipulator. The arm of the robot manipulator is adapted to move the heating device so that the heating device can apply heat to a selected connector pin of the electrical connector.

A brazing furnace (1) includes a preheating chamber (2) and a brazing chamber (3). The preheating chamber (2) includes: a vacuum pump (21) for reducing the pressure inside the preheating chamber (2) while a material to be processed (100) is housed therein; a preheating apparatus (22), which preheats the material to be processed (100) in a reduced-pressure atmosphere; and a gas introducing apparatus (23), which introduces inert gas into the preheating chamber (2) to restore the pressure inside the preheating chamber (2) after the preheating. The brazing chamber (3) includes: a gas-replacing apparatus (31), which introduces inert gas into the brazing chamber (3); and a main heating apparatus (32), which heats the material to be processed (100) to a brazing temperature while it is housed in the brazing chamber (3).

An example method of joining a first substrate with a second substrate includes applying a filler material between respective portions of the first substrate and the second substrate, the filler material including an electrically conducting and/or magnetic material, wherein the filler material and the respective portions define a joint; applying an alternating magnetic field to the joint to heat the electrically conducting material to a reaction temperature; in response to heating the electrically conducting material to the reaction temperature, energizing the joint using energy released from the electrically conducting material; cooling the joint to join the first substrate with the second substrate.

A method for creating a bonded zinc-coated structure is provided. In another aspect, a sheet metal joining system includes a heated roller contacting a sheet metal workpiece to braze together zinc-based coatings. A further aspect employs a zinc coated metal sandwich including a core having peaks and valleys.